Electronics Forum | Mon Jan 07 20:37:15 EST 2002 | davef
For soldered areas, we like to keep gold thickness substantially below the maximum you propose. Search the fine SMTnet Archives for our discussions on the topic of acceptable levels of gold with solder connections. Let�s fix this �no one seems be s
Electronics Forum | Wed Jan 09 11:14:39 EST 2002 | stefwitt
I wished, I would get a job like that. Malta is a nice spot! With 1500 Cph you can select any machine on the market, but here are some questions. If you use a glue machine you apparently deal with mixed technology boards. If your volume is that low,
Electronics Forum | Wed Jan 09 11:09:53 EST 2002 | slthomas
Is anyone still using Loctite 348 chipbonder for bottom side attachment? Is it truly adequate for dispensing up to 18k/hour? We will be dispensing with a Camelot 2800, so somewhere in the neighborhood of 15k/hr. is as fast as we'll ever see. I'm c
Electronics Forum | Sat Aug 10 06:38:25 EDT 2002 | jojojameson
Dear Freinds, We are having 18000 sqfeet airconditioned space for pcb contract manufacturing.We had chipschooters,through hole machines & fine pitch placement machines with international standard.In addtion we had clean rooms & wire bond facilities.W
Electronics Forum | Mon Jan 14 15:15:25 EST 2002 | burb1999
Currently our company is in the process of putting together a SMT prototype line... I have experience with fuji, universal, DEK, MPM, BTU, Electrovet in a high volume application. Now with prototype builds we have narrowed down a few and would like
Electronics Forum | Tue Jan 15 06:05:37 EST 2002 | Romain
Dear all We have since few weeks problems with BGA solder joint integrity on ENIG finish. Under relatively very flexible of the FR4, the joint breaks between ball and PWB. When we take off the BGA for analysis, some of the pads seem very flat, totaly
Electronics Forum | Wed Jan 16 07:49:14 EST 2002 | Yannick
Hi, In few weeks I want to test the capabilities of our SMT Line. To do that I'll design a board. I want to test: - The Printing - The component placement - The soldering - Different stencil aperture - Mixed Technology (Thr
Electronics Forum | Mon Jan 21 15:55:53 EST 2002 | Yannick
The point behind traces and vias on my test is that I don't only want to perform test on printing and placement but on reflow too, so a board with many components and no trace will not react like a board with traces on it. Unless you or someone else
Electronics Forum | Wed Jan 16 11:20:52 EST 2002 | bentzen
Hi... We tend to do a lot of footprint calculating for new SMD components. But what about the amount of solder paste on the solder pads. The amount of solder alloy is of cause determined by the stencil aperture size, stencil thickness and the sold
Electronics Forum | Wed Jan 16 21:07:26 EST 2002 | davef
We looked at buying a scanner set-up a few years ago, but could not justify it. So, we use contract scanners, like: Advance Reproductions Corp 100 Flagship Dr.,NAndover, MA 01845 508 685 2911 fax 9564/201 697 1339 Martin Crowley Rep 201 697 1339 Sca