Electronics Forum | Tue Jun 28 16:41:07 EDT 2005 | mattkehoe
Yes, .062 fr4. Like I said before, we run a lot of gold boards, as many as 25% of what goes through the shop, and we've never adjusted anything before??? Many of these are bigger by 2 X and much more dense. Reflow is not as shiny as HASL but always u
Electronics Forum | Tue Jun 28 18:20:49 EDT 2005 | russ
Matt, have you run a profile on this board? Just because it's .062" doesn't mean that any old .062" profile will work. We have .062" thick boards that almost nil for copper and other are utilizing 2 oz. layers internally. They require quite diffe
Electronics Forum | Thu Jun 30 18:40:06 EDT 2005 | KEN
What your asking has many variables. 1. Material: SS vs. Cast Iron. Iron is thicker. Which SS? 316, 316L 2. Pump speeds, turbulence, hours of operation directly affect equipment life. 3. Things like scraping the pots, the tunnels, impelle
Electronics Forum | Fri Jul 08 09:57:31 EDT 2005 | fctassembly
Proy, Another issue is what exact formulation of SAC is used. Much of the SAC305 being used in Asia contains phosphorus, which is added in an attempt to reduce the heavy drossing that SAC305 produces. Phosphorus acts as a flux on steel so will increa
Electronics Forum | Thu Jul 28 09:47:06 EDT 2005 | fctassembly
Hello Carl, The main reason there is little information on lead free soldering to ENIG is because most of the lead free soldering to date has been Japanese consumer products. To keep costs down, the major surface coating used has been OSP copper. It
Electronics Forum | Mon Jul 04 22:09:08 EDT 2005 | grantp
Hi, I have one for sale, do you want it! MYDATA machines are perfect for low volume high mix production, and are fairly easy to operate. Don't get a TP model, as they cannot take the HYDRA head, and the MY series are much better. The good thing is
Electronics Forum | Tue Jul 05 11:00:37 EDT 2005 | patrickbruneel
Inds, This will happen with all lead-free alloys having a tin content above 70%. It takes about 30 sec. for a molten lead-free alloy to totally dissolve a copper pad. The higher the temperature the shorter the time and visa versa. The scary part of
Electronics Forum | Tue Jul 05 17:16:01 EDT 2005 | davef
We agree with Pat, but it's far from straight forward. [er maybe we should say we don't understand it.] We duplicated the results of a posting on the web. Flux, then dunk copper wire into tinning pots set at 250*C for measured periods of time. The
Electronics Forum | Wed Jul 06 13:06:22 EDT 2005 | patrickbruneel
Dave, Great to see you more involved in the lead-free. I assume the tests you have done were in lab environment, would it be possible to explain how you measured the area reduction (loss of weight or reduction of diameter/thickness) and how did you
Electronics Forum | Wed Jul 06 16:40:05 EDT 2005 | Inds
the problem with using SAC305 is we have a very small window within which the connnector has to be removed.. otherwise Cu will dissolute. Now this process window is something between 20sec to 30 sec..depending at what temperature you are reworking th
