Electronics Forum | Mon Jan 04 23:15:35 EST 1999 | Kris Ewen
Where I worked, we used 0.014" square aperatures (several mfgs. have proven the benefits of square & I've seen a better transfer efficiency myself). Some mfgs use smaller edge lengths & have had success. 0.005" thick stencils give better transfer e
Electronics Forum | Thu Oct 08 14:04:04 EDT 1998 | Kris Ewen
Manish, I've seen similar phenomenon when processing CSPs on our cards. In our case, we were placing the components over the opening to in-pad blind vias. Due to poor drilling and plating processes by our board suppliers, volatiles were outgassing
Electronics Forum | Tue Apr 09 16:25:28 EDT 2002 | clarkk
Alan, You're right, mass inspection after assembly won't work. The inspectors will miss 25% (or more) of the defects, and the boards will be reworked before SMT operators can properly define defects and their sources. The company I work for tends to
Electronics Forum | Mon Apr 22 18:40:14 EDT 2002 | Steve Townsend
It's not impossible to balance in a non-repetitive situation. You'll need to investigate mix-model JIT methods. It takes more effort, but it is very possible. First is to figure out which assemblies are going to be the most similiar, which ones use
Electronics Forum | Tue Feb 11 17:14:50 EST 2003 | Matherat
Traditional methods of hand assembly are as you described. For a company that is concentrating on the 1-5 or 5-50 quantities you've described, you need to look for ways to accomplish your task with speed, repeatablilty, quality and at a fair price. T
Electronics Forum | Fri Sep 05 15:47:50 EDT 2003 | Hoss
Hello, We're an EMS provider doing low volume/high mix production. We've found a hole in our ECO and revision control systems that needs to be fixed. Within our ERP system, whenever possible, we try to keep the customer rev of an assembly as our i
Electronics Forum | Fri Feb 24 10:21:59 EST 2006 | Board House
TM, When picking a material for your lead free assembly you need to think about a couple of things, The standard Material in the US that is being used is running 140 - 170 tg. material. But for lead free assembly you need to focus on is Decomp tem
Electronics Forum | Thu Jun 29 13:27:20 EDT 2006 | pjc
Verify that the CEMs machines and processes are capable of assembling the technology of your boards- smallest components, largest components, finest pitch, flex circuits, etc� Are their core competences aligned with your requirements- assembly only,
Electronics Forum | Tue Jan 02 16:49:14 EST 2007 | dyoungquist
I am looking for data on the yield of printed circuit board assemblies so that I can judge if our SMT line is performing up to typical industry standards. Following I will describe the details of the assembly and what our yield has been. Each board
Electronics Forum | Thu May 10 19:19:41 EDT 2007 | rgduval
Wayne, I haven't seen anything indicating that Gold Immersion is necessary for lead free... However, it is my companies preferred finish for lead free assemblies. We've taken this stance for the following reasons: 1. Better solder quality on th
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