Electronics Forum: electronic assembly (Page 271 of 598)

Cleaning procedure when WS609 flux is used

Electronics Forum | Fri Jan 18 18:19:38 EST 2008 | arun2382

Is normal DI rinse cycle enough to wash away all residue after SMT assembly of high density substrate? This substrate would later be over molded to form MCM module package and I am seeing delamination in high density areas of the substrate at MSL3

PCB Delamination

Electronics Forum | Thu Nov 20 13:00:36 EST 2008 | jameskelch

Calling out materials by name locks you into laminates by brand. If these are typically phenolic materials it can lead to moisture absorption, less mechanical strength and more prone to delamination during assembly. It is more effective to refer

PTH lead milling

Electronics Forum | Mon Feb 18 08:56:44 EST 2008 | operator

It does exist. We used to have one here, but sold it. It was more of a manual process though. You put the assembled board on the work table and then set your cutting blade height. Then you manually moved the cutting blade around shearing off the TH l

Assembly work instruction

Electronics Forum | Thu Mar 13 09:24:56 EDT 2008 | scotceltic

We use a program called Circuitcam by Aegis. It allows you to import all types of Cad and associate the parts to the different processes. Ex. SMT, Radial, Inspection, Hand Insert. (Customizable depending on your process) Once this is complete it

Assembly work instruction

Electronics Forum | Mon Mar 17 08:45:59 EDT 2008 | karkanov

Picture are great but yuo need to take them in the same times as the first run. You can't do it before, so you people loose some time when you take the picture and are not quiet sure what to do if your not able to be with them. That's why it is goo

PCB Test and Troubleshooting Rates

Electronics Forum | Tue Mar 25 10:11:03 EDT 2008 | bandjwet

We recently sent some PCB assemblies along with the schematics to a test services provider. Afer paying for the NRE tooling charges we were paying $75.00 per hour for the service providers Level 1 test technicians. Does this sound like a fair rate (w

Sealing Clips

Electronics Forum | Wed Mar 26 20:48:22 EDT 2008 | davef

Sealing clip, clamps used in semiconductor, hybrid packaging * Connor Manufacturing Services; 16233 N.E. Cameron Blvd., Portland, OR 97230; 503-256-0230 F503-256-0246 connorms.com * Electro Assembly Source; 602 Sciandro Dr, Greensburg PA 15601; 724-8

Ultra low cost pick & place?

Electronics Forum | Tue May 13 08:02:28 EDT 2008 | avalancher

Interesting thought. Among the many thoughts that came to mind while reading your post, one stands out for me. While making a cost effective machine is a great idea, it seems obvious that there will be some trade offs on quality. The cheaper the ma

SMD ASSEMBLY & TEST EBOOKS NEEDED

Electronics Forum | Thu May 29 11:02:23 EDT 2008 | markhoch

Omid, Your best bet would be to obtain and read the various machine manuals for the equipment that you have. HOWEVER, "programming" the reflow oven, (otherwise known as profiling), is product and solder paste specific and will most likely NOT be cove

Thermal Relief BGA footprint design - traces - reflow

Electronics Forum | Tue Jun 03 12:29:58 EDT 2008 | slthomas

We don't build anything with BGA yet so don't have this standard but IPC-7095B, Design and Assembly Process Implementation for BGAs would be a good place to start. I don't know for a fact that it contains info. that applies specifically to your iss


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