Electronics Forum | Fri May 03 01:25:33 EDT 2002 | gerits
Dear Sir, I do not want to mix in this "subjective" discussion but as an employee of Assembl�on (buider of FCM II, FCM multiflex 50, 75, 100) I can provide you with MTTR, MTBF, placement data (0201), software, and other (also customer) data on our e
Electronics Forum | Mon Jul 15 16:02:39 EDT 2002 | tmv
Agreed that the FCM has been the choice in the past...but have you seen the 4797S HSP (TCM X100)? Usually (2) 4797S's can replace (1) FCM for about the same purchase price, and only a slighly larger footprint (consider the cost of ownership as well..
Electronics Forum | Mon May 06 10:55:30 EDT 2002 | Eric Miller
I am looking for anyone who may have information > on adjustable reflow pallets. Could you please > provide a supplier and contact. My dilema is that > during an initial NPI build the PCB's may not > arrive with rail adds. I need a way to transfe
Electronics Forum | Mon Apr 29 02:50:03 EDT 2002 | Bob Willis
The basic guidline is lead size plus 0.010" which you can also use for through hole reflow/intrusive reflow. Most suppliers of the insertion equipment quote this as the minimum clearance hence its a good guide. Druing recent trials for through hole
Electronics Forum | Tue May 07 02:58:27 EDT 2002 | dwoon
Hi, We are looking for some measuring machines to evaluate the ability of a SMT placement machine to produce quality. We will mount some dummy components on a glass plate and then insert the assembly into the measuring system which can measure the
Electronics Forum | Mon May 13 10:37:56 EDT 2002 | fmonette
The other important issue relates to moisture sensitive devices (MSD). If you have MSDs on the first side, you need to track the remaining floor life of the components on the partially assembled boards between the first and second reflow. Contrary to
Electronics Forum | Wed May 15 19:55:19 EDT 2002 | russ
Good point, I am preheating for 90 sec to a temp of 170 C. (PCBA) then reflowing for 40 sec. to bring it to 215 C. I will try a softer hammer. This has been working on other assemblies with the same package however. Do you know if a water soluble
Electronics Forum | Wed May 29 00:28:11 EDT 2002 | alex_kirichenko
Hi Ben! I was in your position just over 12 months ago.. We use round appetures for BGAs and don't have any problems with it, as long as thiknes of your stencil is correct. As for baking BGAs befor placing. I haven't had any problems with devices
Electronics Forum | Wed May 29 14:42:53 EDT 2002 | jaltland
I have another question about bga's and stencils. We were told by a manufacturer to use .012 square apertures for .009 dia balls. The original pick & place and reflow goes pretty well (over 95% good), however when we have to select components on th
Electronics Forum | Wed May 29 17:17:49 EDT 2002 | wilcoxito
As far as aperture dimensions go, I found a technical note written by Micron that recommends using "square apertures with sides equal in length to the diameter of the PCB pad. The corners of the square should also be slightly rounded, and the apertu
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