Electronics Forum: electronic assembly (Page 361 of 598)

Double sided design

Electronics Forum | Thu Aug 25 10:32:03 EDT 2005 | davef

IPC-2221A, Generic Standard on Printed Board Design, the base document that covers all generic requirements for printed board design, regardless of materials. From there, the designer can choose the appropriate sectional standard for a specific techn

Reflow Oven Selection

Electronics Forum | Thu Aug 25 16:50:13 EDT 2005 | Mark

I have an application that requires soldering pieces of metal (copper plate and copper fins to make a heatsink). Each piece is about 1 lb. I cannot test it in our reflow oven (5 zone) since the piece is about 3" in height. Has anyone attempted to

SMT Assembly

Electronics Forum | Fri Sep 09 13:27:28 EDT 2005 | Denis

Hello, I'm not sure if this is the right place to post this. I am looking for a place that would do surface mounting for me. I have the PCB already made and I have the SMT chip. I have tried soldering it with a solder gun, but I think I burnt out

Cleaning before Conformal Coating

Electronics Forum | Fri Sep 09 15:03:46 EDT 2005 | Amol

Hi, I am running a circuit board that needs a part to be put on it after cleaning and before conformal coating. the only problem is that after cleaning and hand assembly of the part, there is a thin whitish residue in the ckt board that one can see w

Scrap criteria

Electronics Forum | Tue Sep 20 10:32:25 EDT 2005 | slthomas

I would say it depends on the process requirements for the board and the reliability requirements as has already been mentioned. If you do two-sided reflow you might allow for fewer rework attempts, for example. If it's a medical device you might on

Defect reduction on RF design

Electronics Forum | Mon Sep 19 09:02:10 EDT 2005 | clampron

Good Morning Everyone, We have a customer that produces RF based assemblies. We are building several board types for them, all of which have an "RF" area of the PCB. This RF area does not have any mask to define pads. There are also several issues w

High Mix Low Volume : Beck End Floor Loading

Electronics Forum | Wed Sep 21 05:33:34 EDT 2005 | Selva Govind

It's me again I post it before complete the message. Let me start once again. I plan, schedule and deliver SMT production programs for HMLV plant(app 1200 Assemblies). The kind of floor loading I have here is works great for SMT only. I'm considering

Lead/Lead Free In-Line Wash and UT cleaners

Electronics Forum | Mon Oct 03 12:11:18 EDT 2005 | PWH

Soon we will be manufacturing board assemblies on our SMT lines that will utilize both lead and lead free water soluable solder pastes. I have read some discussion about change-over from lead to lead-free jobs related to machine cleanliness, etc. H

lead bearing components in lead-free boards

Electronics Forum | Sun Oct 09 08:28:04 EDT 2005 | davef

First, no one knows very much about the relaibility of Pb-free assemblies, much less Pb-free solder with Pb-bearing components. Second, we do know that Pb-free components work with PB-bearing solder. Third, based on comparison laboratory testing,

Matte Sn Plating

Electronics Forum | Mon Oct 24 17:56:57 EDT 2005 | Ali

Hello all: A couple of queries on matte Sn plating: My Application: 2 Reflows in subassembly reflow+ 8 Hr Steam age+ Solderability (Dip and look) for sub assembly to mother board soldering. Queries on Matte Sn: 1- Different plating vendor


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