Electronics Forum | Tue Mar 23 10:16:22 EST 1999 | Chrys Shea
| Hi Folks, | This is my first surface mount board, so I asked our assembly house for some tips. They said only passives on the bottom side-preferably no smaller than 0805, 0603 only if I have to. I would think that an SOT-23 would be OK on the botto
Electronics Forum | Tue Mar 02 13:00:12 EST 1999 | Bill Haynes
| I'm trying to get a feel for what the industry is doing with regards to collecting assembly defect data in the SMT/PWA process. Is it sampling or 100%? What are the points within the process where critical assembly defect data is collected. We run
Electronics Forum | Wed Mar 03 12:01:08 EST 1999 | Dave F
| I'm trying to get a feel for what the industry is doing with regards to collecting assembly defect data in the SMT/PWA process. Is it sampling or 100%? What are the points within the process where critical assembly defect data is collected. We run
Electronics Forum | Sat Jan 23 16:07:20 EST 1999 | Steve Gregory
| hi, | i am working towards developing a no-clean process for a customer at contract manufacturing facility. the assemblies have gold fingers on them. these are masked to prevent from any damage to them during reflow soldering. the earlier proces
Electronics Forum | Sat Jan 23 16:31:09 EST 1999 | Steve Gregory
| Hi Everyone, | We plan to build, for reliability/experimental/research purpose some CSPs (namely Tessera microBGA 46-I/O 0/75mm pitch and TI 64 I/O 0/8 mm pitch). the various factors that we plan to evaluate are the reliability and assembly concern
Electronics Forum | Tue Jan 12 14:59:14 EST 1999 | Earl Moon
| What would be a good metric for process control of a stencil printer? (fully automatic, vision equipped, stendil printer). | I'm doing some more DEK 265 GSX's with everything imaginable hung on them. Have done Lt's and the MPM2000. This makes mach
Electronics Forum | Wed Oct 28 23:01:57 EST 1998 | Dave F
| I would like to know if there are any standard guidelines for the development of Process Failure Mode and Effect Analysis. If there is can you refer me to the source. | | I would also like to be referred to any source relating to current developme
Electronics Forum | Fri Oct 30 15:09:44 EST 1998 | ChungPark
| Dear all, | | What are your views on reworking BGA's? I mean, with the BGA going through reflow temperatures four times or more, and with a manual reballing process, wouldn't it raise up a few reliability issues? Would you consider not doing rew
Electronics Forum | Tue Oct 20 11:37:38 EDT 1998 | Stefan Witte
All SM machines pick components with a vacuum nozzle. Most likely the component is picked in the geometric center, which may not be the center of gravity ( SOT 23, SO 89 ). Any other pick position than the center may be taught upon requirement, but y
Electronics Forum | Thu Oct 15 14:23:31 EDT 1998 | Earl Moon
| I have a problem with measling on our PCB's. We saw it on our FR4 PCB's at final assembly yesterday. Is this a defect from the board vendor or something we did in our assembly process when building the PCA's (thru hole). Could the wave solder ma
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