Electronics Forum | Thu Sep 26 15:28:16 EDT 2013 | joeherz
I know - A stimulating topic.... IPC-TM-650 2.3.28 method calls for a PCBA or PCB to be placed into a bag with solution, shake, analyze. Great. There is a method of doing this testing that focuses on a specific area of a PCB or a component where r
Electronics Forum | Wed Oct 16 09:55:24 EDT 2013 | markhoch
Thanks guys. I can see the benefit as a CM, when you have no control over the Parts/PCBs that come in the back door. In my previous job at a CM I did often have product coming in the back door that did appear to have exceeded its shelf life, and hav
Electronics Forum | Wed Oct 16 12:51:46 EDT 2013 | deanm
Why isn't the data that is collected being used? Either use the data or stop taking it. Without AOI to improve your process you need to do this: 1. Collect data on all defects found by your inspection department and have it in a form such as a sprea
Electronics Forum | Thu Feb 13 19:08:31 EST 2014 | darby
Have to agree with Sr Tech and Spoilt - you'd have to really mistreat your paste these days for it to be the root cause. However, try another paste to eliminate that; making sure you abide by the suppliers specs. Pad design, stencil design,(includin
Electronics Forum | Thu Mar 20 15:57:57 EDT 2014 | edwaterfall01
The numeric display number should be higher but only when all 7 spindles are moved down slightly from the full up position. The 7 spindles retract up to the Stop Bar. Each spindle assembly has a tapered hole thru it. This hole is in the block with t
Electronics Forum | Mon Mar 24 20:30:01 EDT 2014 | davef
The "correct" answer is: Use the tests and methods that you used to qualify your solder paste in the first place. That sounds good but might not be all that practical for practicing assembly-types. Here's something that's not as good, but will give
Electronics Forum | Tue May 20 18:38:23 EDT 2014 | hegemon
From the picture I would say the problem lies with the PWB manufacturer. It looks as though some part of the plating process was not optimal during the PWB production run, and you have the resulting discoloration following the reflow process. What
Electronics Forum | Sun Jun 01 13:50:12 EDT 2014 | sync40
Thank you for your reply davef. Although the US restriction, I think that there are plenty of users of immersion tin in Americas, mainly low-volume fabs that do not plan to outsource finishing, or do not plan or can not invest in a HASL. If we res
Electronics Forum | Mon Jun 02 15:51:17 EDT 2014 | sync40
Thank you so much again davef for your new reply. This past weekend I was looking for more information regarding this subject, but, as you stated there is no information about thioruea concerns during assembly soldering operations, mainly focused in
Electronics Forum | Wed Jun 18 18:58:10 EDT 2014 | ke6zoy
Hi All, We leadform components for our assemblies in house and have been tinning the leads using a dip methood by hand into a solder pot. by just handling the components during the tinning and cleaning process we are at times damaging the parts/lea
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