Electronics Forum: electronic assembly (Page 501 of 598)

Re: AOI

Electronics Forum | Thu Apr 22 11:04:58 EDT 1999 | Boca

| | I had someone suggest that they weren't really necessary as long as your process is good. Is this just a way to help you keep an eye on your process? | | | | I was thinking, as we set up our line, our money would be more well spent with control

Re: white residue

Electronics Forum | Fri Jan 29 05:14:06 EST 1999 | Graham Naisbitt

Hi guys, I really am at a loss to understand this one. It would appear that there may be some reaction between the flux and the resist? Or maybe you have an OSP on the board that is reacting during soldering? As a fast fix, maybe you should try a

Re: Questions regarding rework

Electronics Forum | Tue Dec 08 17:55:51 EST 1998 | Dave F

1. What is the best way to remove polyurethane conformal coating from selected areas? Your conformal coat material supplier is best equipped to tell you how to remove the coating. Polyurethane conformal coating is not easy to remove. Without in-pu

Re: Prove no-clean is clean / Wadda Mean Clean??

Electronics Forum | Thu Sep 17 11:09:32 EDT 1998 | Dave F

| I need an evaluation process to prove to a customer that our no-clean process does not leave excessive residue? Any ideas? Wayne: More of the same as Chry and Justin. KEY ISSUE The first thing that you need to know is: What does your customer me

Couple questions for Dave

Electronics Forum | Thu Sep 17 12:00:19 EDT 1998 | Mike C

| | I need an evaluation process to prove to a customer that our no-clean process does not leave excessive residue? Any ideas? | Wayne: More of the same as Chry and Justin. | KEY ISSUE | The first thing that you need to know is: What does your cus

Re: lid soldering problems (CQFP, Au/Sn solder)

Electronics Forum | Fri Sep 18 08:49:12 EDT 1998 | Earl Moon

| | We have problems with voids when we solder lids to | | ceramic flatpackages. | | The sealring of the package is gold(100 micro inches or 2.5 micro meters)with a underlayer of Nickel | | The solder is attached to the lid (preform) and the solder

Re: SMT repairs using wire links

Electronics Forum | Fri Sep 11 09:36:04 EDT 1998 | Earl Moon

| | I'll stop talking to myself and wonder how big Steve G is doing these days. | | Earl Moon | Hey Earl! | I was wondering the same thing about you a few weeks back when we didn't hear much from you...but, I'm doing okay. Been busier than a one

Re: Solder mask materials and equitements wanted

Electronics Forum | Sat Aug 29 08:43:35 EDT 1998 | Dave F

| Hi, Friends, | Could you please recommend me some solder mask materials and equitements for high quality solder mask? Details such as company name, phone numer et al are welcomed. Thanks! | Have a good day | Xingsheng Xingsheng: Consider the follo

Re: reliability of epoxy

Electronics Forum | Fri Aug 07 01:02:51 EDT 1998 | zeek - just wanna to get a word in here

| | I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and t

Re: BGA reflow profile

Electronics Forum | Tue Jul 28 09:15:49 EDT 1998 | Justin Medernach

| We are about to run our first BGA devices and would appreciate some confirmation on a few points. | First some details: | PCB & Device: | ============= | 1) 16 layer (4 power, 4 gnd, 8 signal) | 2) gold on nickel finish | 3) ceramic BGA with eutec


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