Electronics Forum: electronic (Page 1241 of 7890)

BGA assemble

Electronics Forum | Thu Oct 05 16:41:05 EDT 2000 | Sergio Vito

We are starting to assemble an BGA-225. To assembly only 20 prototype (1 BGA per PCB) is it necessaray buy equipaments for inspection? Like x-ray? Can someone sugest especial carefull to assembly this CI? Thanks in advance!

Solder Class 1,2,3

Electronics Forum | Thu Oct 05 07:43:22 EDT 2000 | Leon

Anyone know where I might find info on class 1 class 2 and class 3 solder joints.

Re: Solder Class 1,2,3

Electronics Forum | Thu Oct 05 09:01:19 EDT 2000 | LarryK

The IPC-A-610 has the Acceptability requirements and the ANSI/J-STD-001 has the Requirements for soldering. Both deal with the requirements for the individual classes. Both of them are published by IPC and can be purchased in lots of places includ

Re: Looking for advise on Spare parts/ Used Equipments

Electronics Forum | Thu Oct 05 12:18:44 EDT 2000 | aaronho

Try the following address: FastParts.com www.xytek-equip.com www.ibe-surplus.com I think the best way is go to the original suppliers Go luck.

Re: Robotics

Electronics Forum | Wed Oct 04 14:01:30 EDT 2000 | Danny Carr

Frank, Check with the Industrial Robotics Forum: http://www.industrycommunity.com/myforum/paul_sprunger/index.html Good luck! Danny

Re: Robotics

Electronics Forum | Wed Oct 04 15:43:36 EDT 2000 | CAL

Contact Cyclone/ Stein Automation who uses St�ubli often with automation. www.cycloneind.com They may beable to help with your project Cal

Flip Chip Flux

Electronics Forum | Sun Jan 28 15:25:28 EST 2001 | Kelvin

Dear Chris, I suppose that you may contact Alpha Metals or Cookson Semiconductor guys. They offer several types of no-clean flux for flip chip application. I hope it would not be too late. Kelvin

Adhesive Dispenser Vs. Screen Printing Adhesives Pros and Cons

Electronics Forum | Tue Oct 03 07:48:52 EDT 2000 | steveZ

Had cheacked the archives but I didn't see much about their comparison: 1. Throughput 2. Rework Rate 3. Effect on Placement Accuracy 4. Cost (cheaper or more expensive in the long term?) Has anyone compared the above. Please help me.

Re: Adhesive Dispenser Vs. Screen Printing Adhesives Pros and Cons

Electronics Forum | Tue Oct 03 11:35:51 EDT 2000 | aaronho

Screen printing has much lower profile than dispensing. So it is suitable for chips without body stand-off, (Even sot23 has stand-off). But is is much faster. Dispensers can not catch up with some chip shooters.

Re: Adhesive Dispenser Vs. Screen Printing Adhesives Pros and Cons

Electronics Forum | Thu Oct 12 19:47:24 EDT 2000 | Dave F

Fraser: You're correct!!! We did our analysis on paste rather than glue and I missed that when changed things to respond.


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