Electronics Forum | Fri Sep 21 14:24:52 EDT 2001 | Steve Vargas
We are considering buying a 1996 vintage CR Technology RTI-6500 inspection system. Its primary use will be to inspect for SMT part presence / absence. Has anyone used or had any experience with this piece of equipment? Thanks.
Electronics Forum | Thu Sep 27 08:00:22 EDT 2001 | Steve
We are a high mix, low volume shop. Average lot size would be 50 - 150 boards. My concern is how the machine will handle the high mix environment.......
Electronics Forum | Mon Sep 24 05:50:23 EDT 2001 | dwoon
Has anyone used or had any experience with Fuji & Quad for large board assembly? What is the maximum board size that a Fuji & Quad can support? Many thanks in advance.
Electronics Forum | Mon Sep 24 12:27:43 EDT 2001 | nwyatt
I've used Fuji for fairly large boards. The largest pcb size is 20" by 18" for pick and place; 18"x14" for chip shooters. I've never used Quad. N
Electronics Forum | Wed Oct 03 05:32:20 EDT 2001 | dwoon
Hi Doug, How about the active placement area? Will the placement area be limited below 27" x 23"? Thanks for your clarification.
Electronics Forum | Wed Oct 10 13:17:27 EDT 2001 | BrianC
Universal now has Big-Board options and retrofits for GSM's. 32" kits and 25" kits. If you call them, they will come. Brian
Electronics Forum | Mon Sep 24 20:38:27 EDT 2001 | davef
Mike's comments are well taken. Your technique works fine with BGA, but uBGA are less forgiving. Again, let's take about: * Specifics of the problem. * Amount and method of applying flux. * What's holding the uBGA in-place before the solder ball an
Electronics Forum | Tue Sep 25 09:57:40 EDT 2001 | nwyatt
In regards to your last question, - problem is failures and most think it is due to too much flux - we apply flux with a brush - amount applied depends on the operator applying it - the flux is very thick and will hold the part in place before reflo
Electronics Forum | Fri Sep 28 16:51:41 EDT 2001 | pcmarch
I have had success by applying the paste flux with my finger, using a finger cot and spreading it on the PCB. This seems to put it on more consistently than using a brush.
Electronics Forum | Mon Sep 24 18:00:58 EDT 2001 | jagman
Does anyone know the cause(s) of solder flowing through a via to the other side of board during reflow causing solder bumps on opposite side? Is this mainly a design issue or could it be process related? Any help is appreciated.
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