Electronics Forum: electronic (Page 1676 of 7890)

Baron Blakeslee Model MVR 432

Electronics Forum | Mon Sep 23 19:13:58 EDT 2002 | jolbca

I am looking for a Baron Blakeslee Model MVR 432 vapor degreaser with a freeboard chiller. Please let me know if you have any near California.

thread "SRT BGA rework"

Electronics Forum | Tue Oct 08 17:33:56 EDT 2002 | dragonslayr

user just posted today. Thre are 5 identical copies of the users question. maybe a little clean up is needed?

Solid Press Fit pin-0.018 Square

Electronics Forum | Wed Sep 25 07:53:10 EDT 2002 | zanolli

Send me a drawing or sketch and I may be able to reccomend a supplier. fax: 401-781-5730 phone: 401-785-4110

Solid Press Fit pin-0.018 Square

Electronics Forum | Tue Oct 08 19:02:03 EDT 2002 | mjabure

Have you checked out autosplice? their URL is http://www.autosplice.com. They may be able to help you out.

Recycling Matrix Trays

Electronics Forum | Tue Sep 24 14:48:10 EDT 2002 | ChrisN

Looking for outside company that recycles matrix trays and plastic reels for surface mount components. I am trying to find a company that will provide boxes and be willing to pickup our reels and matrix trays to return back to suppliers for refund.

Recycling Matrix Trays

Electronics Forum | Tue Sep 24 19:15:12 EDT 2002 | davef

Search the fine SMTnet Archives for background on this, Chris. Here one example: http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=4515&#Message17601

PCB finish requirement for COB process

Electronics Forum | Tue Sep 24 23:03:14 EDT 2002 | redmary

we used the ball bonding, just normal chip on board. as I know the the electroless Ni/immersion Au, the gold thickness is about 0.13um at most, what about chemical plating or electrolytic plating? any experience on it, thanks

PCB finish requirement for COB process

Electronics Forum | Fri Sep 27 10:05:07 EDT 2002 | oconnorp

I spec COB using wire bond attach - 0.75um � 0.25 Gold over 5um � 3 Nickle.

PCB finish requirement for COB process

Electronics Forum | Fri Sep 27 11:20:21 EDT 2002 | davef

Mar, The previous post makes the best point. Your finish spec depends on the COB process you plan to use. Is your process: * Gold wire bond * Aluminum wire bond * Flip chip * Er, watt

Flat Plate

Electronics Forum | Thu Sep 26 12:21:24 EDT 2002 | dragonslayr

What are the specs of a Formica type bench top? Gloss or mottled finish? Should the edge be straight, rolled or bull-nosed? Can I get it in ESD safe composition? Can you recommend a good calibrator of formica?


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