Electronics Forum | Fri Jan 16 15:34:56 EST 2009 | black5629
Thanks, we tried using some very fine sand paper and did improve. Any one know of any chemical that would work.
Electronics Forum | Wed Jan 21 06:09:37 EST 2009 | gregoryyork
Try a typical Stencil Cleaner with Glycol ether mix as probably solder resist residue depositing back onto the pads during levelling. Cheers Greg
Electronics Forum | Thu Jan 22 09:59:18 EST 2009 | jeffcali
try making your boards in the USA. There's better QC, and if any problems do happen, they can be solved easily and quickly saving you money in the run. You get what you pay for. Good luck.
Electronics Forum | Sat Jan 17 17:42:07 EST 2009 | viresh
what is the impact if a solder paste is used after 24 hours after tawing time
Electronics Forum | Wed Jan 21 03:34:05 EST 2009 | mrdtech
Sorry if that sentence there was not really clear. I meant: don't to try to 'revive' old paste or paste that has been on the stencil for a very long time using fresh paste.
Electronics Forum | Sat Jan 17 18:03:13 EST 2009 | viresh
hi all i need SMT (FUJI NXT) line process audit check sheets can any boudy help at least which are the points to be added Regards praveen
Electronics Forum | Mon Jan 19 10:30:30 EST 2009 | evtimov
Hi, using a nitrogen should give you different solder joints, than using just air. The joints should be more shiny and clear. With air they should remain more blurry. Emil
Electronics Forum | Tue Jan 20 06:19:12 EST 2009 | lkpdsund
I mean compressed air... But what is the difference between dull and shiny joints? Is it better electric conduct? Does the N2 obstruct voids i.e. ??? Thank you for your answers.
Electronics Forum | Tue Jan 20 13:29:48 EST 2009 | davef
While you're waiting for others to reply, search the fine SMTnet Archives to find threads like http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=57106
Electronics Forum | Thu Jan 22 05:29:25 EST 2009 | johanhuizing
I think IPC-4552 is define the thickness of Nickel as: 3 to 6�m and Gold as: 0,05�m minimum
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