Electronics Forum | Fri Oct 07 09:05:39 EDT 2011 | emeto
what do we compare? Any particular models or in general? I personally like the new Fuji NXT II. Having this small modules you can basically generate machine for your production. It is very flexible. I see now other companies trying to do the same th
Electronics Forum | Fri Oct 07 12:57:08 EDT 2011 | wrongway
Hello all I would'nt trade my universal machine smt or thur hole for any other brands if for no other reason just the support is second to none just my two cents
Electronics Forum | Tue Oct 11 11:17:04 EDT 2011 | adp23
are you familiar with UL 796, Printed Wiring Boards i believe they discuss some standards and test procedures regarding conductor material, and solder material but im not sure if UL actually lists solder material by it self.
Electronics Forum | Tue Oct 11 11:34:09 EDT 2011 | davef
Here is copy of UL796: http://www.innovative-circuits.com/docs/UL%20796.pdf We'd consider this copy unofficial, but it probably tells you what you want to know.
Electronics Forum | Tue Oct 11 09:21:33 EDT 2011 | davef
Can you use trichloroethylene to clean boards? Yes Should you use trichloroethylene to clean boards? NO!!! Don't use trike. It is an environmental and a personnel health hazard. What are you looking to clean from your boards?
Electronics Forum | Wed Oct 12 03:20:42 EDT 2011 | pinktoh
Any recommendations for a good PIN FRIENDLY PB-Free ROLO solder paste? My process is OSP double-sided reflow with PTH wave soldering.
Electronics Forum | Wed Oct 12 10:20:27 EDT 2011 | dilogic
If you can share your thoughts and experience with Agilent's SJ10 AOI, I would be very thankful. - Deni
Electronics Forum | Thu Oct 13 14:24:10 EDT 2011 | dphilbrick
You can use a paste that flows at 2 different temps. (first side flows hotter than second side) Glue, as stated in other answer and capton tape covering the BGA will defect enough heat usually as well.
Electronics Forum | Thu Oct 13 16:08:11 EDT 2011 | davef
BGA solder joint reliability is actually improved slightly from a double-sided reflow. [Jean-Paul Clech APEX 2003 Solder Joint Reliability of BGA Assemblies]
Electronics Forum | Thu Oct 13 23:50:50 EDT 2011 | kemasta
Hi Doug Nice idea (2 type paste), I will have a trial. We think of glue and tape too, but it involve cost, but we still keep as an option. thanks.
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