Electronics Forum: electronic (Page 3031 of 7890)

UIC vs Fuji

Electronics Forum | Fri Oct 07 09:05:39 EDT 2011 | emeto

what do we compare? Any particular models or in general? I personally like the new Fuji NXT II. Having this small modules you can basically generate machine for your production. It is very flexible. I see now other companies trying to do the same th

UIC vs Fuji

Electronics Forum | Fri Oct 07 12:57:08 EDT 2011 | wrongway

Hello all I would'nt trade my universal machine smt or thur hole for any other brands if for no other reason just the support is second to none just my two cents

UL - Underwriters Lab - Solder

Electronics Forum | Tue Oct 11 11:17:04 EDT 2011 | adp23

are you familiar with UL 796, Printed Wiring Boards i believe they discuss some standards and test procedures regarding conductor material, and solder material but im not sure if UL actually lists solder material by it self.

UL - Underwriters Lab - Solder

Electronics Forum | Tue Oct 11 11:34:09 EDT 2011 | davef

Here is copy of UL796: http://www.innovative-circuits.com/docs/UL%20796.pdf We'd consider this copy unofficial, but it probably tells you what you want to know.

Is Trichloroethylene recommended for PCB assembly cleaning ?

Electronics Forum | Tue Oct 11 09:21:33 EDT 2011 | davef

Can you use trichloroethylene to clean boards? Yes Should you use trichloroethylene to clean boards? NO!!! Don't use trike. It is an environmental and a personnel health hazard. What are you looking to clean from your boards?

Pin friendly paste

Electronics Forum | Wed Oct 12 03:20:42 EDT 2011 | pinktoh

Any recommendations for a good PIN FRIENDLY PB-Free ROLO solder paste? My process is OSP double-sided reflow with PTH wave soldering.

Agilent SJ10 experience

Electronics Forum | Wed Oct 12 10:20:27 EDT 2011 | dilogic

If you can share your thoughts and experience with Agilent's SJ10 AOI, I would be very thankful. - Deni

Reflow Bottom BGA without pallet

Electronics Forum | Thu Oct 13 14:24:10 EDT 2011 | dphilbrick

You can use a paste that flows at 2 different temps. (first side flows hotter than second side) Glue, as stated in other answer and capton tape covering the BGA will defect enough heat usually as well.

Reflow Bottom BGA without pallet

Electronics Forum | Thu Oct 13 16:08:11 EDT 2011 | davef

BGA solder joint reliability is actually improved slightly from a double-sided reflow. [Jean-Paul Clech APEX 2003 Solder Joint Reliability of BGA Assemblies]

Reflow Bottom BGA without pallet

Electronics Forum | Thu Oct 13 23:50:50 EDT 2011 | kemasta

Hi Doug Nice idea (2 type paste), I will have a trial. We think of glue and tape too, but it involve cost, but we still keep as an option. thanks.


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