Electronics Forum: electronic (Page 3821 of 7890)

Re: Baking PCB's before Assembly

Electronics Forum | Thu Feb 24 18:08:42 EST 2000 | Travis Slaughter

Baking boards, especially multi layer, will help with blowholes and delimitation, but not with solder balls. Normally about 120c for 1 hour or so is sufficient. I usually will not go to this trouble unless a board has proven to be a problem or if th

Re: Baking PCB's before Assembly

Electronics Forum | Fri Feb 25 10:23:46 EST 2000 | K3 Equipment

Greg, If you are having a problem, i would first check board manufacturers process. Also are they shipping boards to you in seal packages (a must if you are in a humid part of the country.) Most of the time with a few simple process controls moistur

Re: Baking PCB's before Assembly

Electronics Forum | Mon Feb 28 17:16:38 EST 2000 | Stu Leech

We just got a lesson on the effectiveness of heat sealed metalized vapor barrier bags. A customer sent us two bags of 100% saturated PBG components by air freight. This was for a demoisturizing test. When we found the devices 80% dry when they arrive

Recycling of Waste Packing Material

Electronics Forum | Thu Feb 24 14:42:56 EST 2000 | Ashok Dhawan

We are looking for a source which can accept our packing material ( PVC tubings, Chip Trays, reels and spools , PCB waste rails from depanalization). Anybody, who is currently using a recycling manufacturer for these packing wastes. Our intent is:

Re: IP3 Lock-Up

Electronics Forum | Thu Feb 24 16:35:02 EST 2000 | D Scott

Larry, I have seen this problem on our IP-3 also. You can recover from this without powering down by going into the I/O page and turning off that particular function. The machine should be fine once you exit out of the I/O page. It almost acts like

Looking for feedback from our site users on the Career Center

Electronics Forum | Thu Feb 24 08:51:23 EST 2000 | Brandy Ford

SMTnet is here for our users. One of our goals is to make SMTnet as user friendly as possible. We are in the process of building an effective Career Center to better serve you, but are looking for your feedback as to what YOU believe would improve

Re: Looking for feedback from our site users on the Career Center

Electronics Forum | Fri Feb 25 17:25:05 EST 2000 | Brandy Ford

Thank you for your response Michael- I agree with you completely. Though there are fields for the employer to fill out, they are not required fields. Should we make them required? What job that you are interested in that doesn�t have a location

BGA SOLDER BALL to SURFACE PAD size relationship

Electronics Forum | Thu Feb 24 06:09:26 EST 2000 | Robert Hutton-Squire

Hi, - any suggestions welcome... I have a 484 pin ALTERA fineline BGA - ball pitch 1mm (40) - ball size 0.48mm (18.9) What would you recommend for... 1. Surface pad size for the balls of this BGA device? 2. Stencil thickness/type and hole a

Re: BGA SOLDER BALL to SURFACE PAD size relationship

Electronics Forum | Thu Feb 24 10:52:41 EST 2000 | JAX

Robert, Here's my recommendation's: Solder paste opening on screen should equal the solder mask opening on board. Stencil thickness at .008" but this should not be your main concern as stencil thickness should be determined by the fine pitch that ar

Re: Wave Soldering

Electronics Forum | Thu Feb 24 13:12:38 EST 2000 | Dave F

Ver: The best thing I could do is send you to Bob Willis' site (www.bobwillis.co.uk or something like that), suggest that you root-around there and find one of his procedures that will help you, and come back and we'll refine your process. Good luc


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