Electronics Forum | Wed May 24 17:09:05 EDT 2000 | Chris McDonald
We have A V-Tek using pressure sensitive cover tape but the only success that we have found is with SO-8, S0-14, SO-16 anything wider and the tape pulls apart when on our feeders. ANything over 16 wide is not recommened unless you get a heat sensitiv
Electronics Forum | Thu Jun 08 09:24:15 EDT 2000 | obrienk
I've been impressed with Universal Instruments in Binghamton, NY. We've been working on a possible SMT line with them because they do everything from soup to nuts. The quality/service so far has been great (and to Dave F's comment, I believe they've
Electronics Forum | Thu Jun 08 21:56:41 EDT 2000 | Thomas Ravener
There are many available: Simplimatic Process Control Technology (PCT) JOT PMJ Bosch Dynapace Nutek Applied Conveyor Engineering (ACE) A wholly owned division of Universal Instruments and made for UIC integration of their products. This is just but
Electronics Forum | Tue May 16 11:10:06 EDT 2000 | Ramon I Garcia C
I don,t speak english very well but I,m trying to give my opinion. I have the same problem but with the conecctor, because I have an IP-II and it hasn,t nozzle origin, I think if "I have an IP-III; I can correct this problem" I think maybe we need t
Electronics Forum | Fri May 12 10:17:54 EDT 2000 | Wolfgang Busko
Hi Ashok, you may look through the archive for "patches - Wolfgang Busko 09:57:37 11/12/1999" it�s exact the same subject. Do you have the newest IPC-standart Jeff is talking about in that thread ? What�s the reason for this measure, component-sho
Electronics Forum | Mon May 15 18:05:11 EDT 2000 | Ashok Dhawan
Busko I could not find anything related to chip stacking in IPC-7711. I guess you meant that some changes will be coming. Probably , a task group is working on that. Can you fax or e-mail that info so that I can have access to that info ? I will ap
Electronics Forum | Wed May 17 05:13:22 EDT 2000 | Chris May
You can refer to ANSI/J-STD-001B section 6.4.3.1 which states: "When part stacking is permitted by the assembly drawing(s)/ documentation, parts SHALL not violate minimum electrical spacing between other parts or components such as terminals or othe
Electronics Forum | Fri May 12 13:42:38 EDT 2000 | Steve Thomas
I also recommend that you take a peek at the archives, as stencil cleaners have been discussed a number of times. I also recommend that you check with your stencil manufacturers to determine exactly what cleaning process parameters are acceptable to
Electronics Forum | Fri May 12 07:32:13 EDT 2000 | David Hatherall
Help. We are about to start a project to test the suitability of attaching a ceramic thick film hybrid to a pcb using solder balls. we have no previous experience of this technique and would like a few pointers in the right direction.. eg recommend
Electronics Forum | Thu May 11 18:59:40 EDT 2000 | lboone
Have anyone perform wave soldering on FR-2 and FR-1 printed circuit board with lead free soldering? Can you share the parameters(wave temperature,preheat temperature, contact time, wave height,etc,) used and did you do any changes to the wave solderi
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