Electronics Forum | Wed Dec 19 10:51:24 EST 2018 | spoiltforchoice
These threads are almost always both created and spammed by the same smallish group of Chinese assemblers with only the very occasional bit of input for/from western EMS providers. the number of EMS providers with banners on the site in understandabl
Electronics Forum | Thu Dec 20 07:08:07 EST 2018 | robl
Hi Prem, OK... Is it definitely ok before the oven, as it's a big part to move. Never had an issue with them. Has the part got the correct z height on or is the paste being displaced on placement What machine are you placing it with (is it laser
Electronics Forum | Tue Dec 25 05:26:43 EST 2018 | premkumar_haribabu
Hi Robl, Thanks for quick reply , I want to see you my attachment first ( forgot to attach in my first share ) .As i said earlier ,Im suspecting termination design made by vishay & I never seen these kind of design from other alternate vendors which
Electronics Forum | Thu Dec 27 14:46:32 EST 2018 | emeto
Hi Prem, it will really help if you provide more pictures and metrics. Pad layout, part datasheet, stencil design and most of all picture of the misplaced part on the board. This looks like a very interesting case and I am willing to help you, but t
Electronics Forum | Wed Jan 02 12:03:13 EST 2019 | jdengler
They go through TN-3 to get to the TSA-200A D/A module. This is all in the MTU. It's been a long time since I worked on an IP-2 but see if you can get to the I/O screen for the MTU. Have someone flag the in range sensor and see if the input status on
Electronics Forum | Fri Dec 21 18:44:23 EST 2018 | ramsus
hello I chose to change the wet cleaning paper and dry paper with wet cleaning mode activation but I have a solvent leakage problem (solvent leak alarm) I detected a leak at the level of cleaner. can you get an idea about this problem and can help m
Electronics Forum | Fri Dec 21 21:02:18 EST 2018 | vinzon02
Hi Team; Does anybody here had a copy of the guideline on Glue dispense standard size specs per component? Currently we are using Camelot dispensing equipment. I'm on the process of making control document on glue size. Please help share IPC stan
Electronics Forum | Sat Dec 22 01:34:26 EST 2018 | sara_pcb
My BGA is 0.5mm pitch with Sn66Pb36Ag2 ball. My PCB finish is HASL. Want to do reflow using Eutectic Sn-Pb reflow paste. My Assembly is IPC Class 3 product. 1. Is there any long term reliability issues with 2% Ag in BGA Ball. 2. If the PCB finish
Electronics Forum | Fri Jan 04 06:28:27 EST 2019 | ameenullakhan
Hi, We are observing solder joint discoloration ( yellow color appearance ) in one of assembly after secondary reflow run. Please provide your valuable feedback. Solder paste : water soluble lead free Alloy : SAC305 Flux : ORM1. Please provide v
Electronics Forum | Mon Jan 21 11:41:39 EST 2019 | SMTA-Tony
Lead free HASL coatings can be susceptible to yellowing during reflow due to oxidation of the tin in the coating. Some HASL solder suppliers use anti-oxidant additives in the solder to limit or prevent yellowing of the coating. You may want to ask
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