Electronics Forum | Tue Apr 11 08:57:35 EDT 2000 | Alfred
Can you get me a recommendation regarding a Micro BGA soldering. It is apparent there is a problem and I want to insure success by following recommended practices. Is there a particular solder mask configuration recommended, as far as stencil thick
Electronics Forum | Sat Apr 08 08:43:34 EDT 2000 | Dave F
Hi Gary: Generally: http://www.tmworld.com/db_prod/companiesbyproduct.cfm?PRODUCTCODENUMBER=201.0∏UCTNAME=Acoustic%20Emission%2FPIND%20Testers LR has a couple of used B&Ws for sale at: http://www.lre.com/test/searchresultx.asp But the coolest, l
Electronics Forum | Tue Apr 11 16:11:06 EDT 2000 | John Thorup
Hello Ashok I can't recall mask damage through normal handling that did not have an adhesion or cure problem as its root cause. Most of our boards arrive shrink packed in groups of 10. We simply pop off the wrap one pack at a time and leave them in
Electronics Forum | Thu Apr 06 00:27:42 EDT 2000 | Dean
I would check their data sheet for the particular product. Thats the range I have for Some Kester products I use... Are you seeing any slumping prior to pick-and-place? Is the bridge in the same place every time? How is your pick-and-place mounting
Electronics Forum | Thu Apr 06 02:23:50 EDT 2000 | Marcus
What about your printer and your stencil ? Do you have a problem with misalignment between pcb and stencil ? How often do you clean your stencil during production ? Maybe you have smearing under the stencil because there is a snapoff between stencil
Electronics Forum | Tue Apr 11 09:45:45 EDT 2000 | emmanuel
Hi Kc, As recommended by the PBGA supplier, the temperature of the package surface should not exceed 225�C during 10 seconds max so as to avoid popcorn effect. Given that some of products reflow profils are specifiing reflow temperature at 250�C,
Electronics Forum | Thu Apr 06 10:50:20 EDT 2000 | John Thorup
As Ioan says,These components usually come in tubes rather than trays. I can understand why you might want to do this because I have one very low volume but complicated board that has seven programmable PLCCs that I just don't have room for on the m
Electronics Forum | Tue Apr 04 06:22:07 EDT 2000 | Neil Stoddart
Help. We are moving to a no clean solder paste and have the following concerns regarding solder balls. What standards are currently being followed concerning solder balls on SMT assemblies? Are these standards realistic and can they be easily achie
Electronics Forum | Tue Apr 04 07:46:03 EDT 2000 | Donnie
Neil, We currently use only visual inspection with a magnified lamp and actually brush the board after the wave process to help knock off any solder balls. You wanna use an ESD sensitive brush material. Camel hair is what we use. It works real wel
Electronics Forum | Tue Apr 04 10:08:33 EDT 2000 | Russ
Neil, IPC 610 has the criteria for solder balls re. quantity and size per sq./in. These are acheivable requirements but no-clean is not necessarily a drop in process. You need to review stencil /pad /component design to ensure that "midship" solde
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