Electronics Forum: electronic (Page 5711 of 7890)

BGA rework: Coplanarity of Xilinx before and after reflow.

Electronics Forum | Mon May 16 15:29:53 EDT 2005 | jdumont

We have the exact same issue with out 456 ball Xilinx parts. The corner balls either do not touch or are so stretched out that they are intermittant. I believe this to be a moisture ingress problem. Ive been setting up our little batch oven this afte

COB Issue's (Non-Sticking)

Electronics Forum | Wed May 18 07:22:06 EDT 2005 | davef

Wire bonds don't stick when bonded * Check pull and shear strength. * Depending on point of failure, review parameters. * Listen during bonding, if there is a high pitch buzz, there is vibration in the system somewhere, "seek and destroy". * Get the

COB Issue's (Non-Sticking)

Electronics Forum | Wed May 18 08:18:55 EDT 2005 | kvanzill

Yes we have purchased a second machine due to low through put so he will be here on the 6th of June....I will be involved with training then, but so far I have not seen great support from this company as far as thier own knowledge of some problems th

Wave Solder Non wetting holes

Electronics Forum | Thu May 19 13:03:18 EDT 2005 | russ

On the non-wetted holes put a solder iron to them and see if they "bubble" if so, you have some outgassing in your PCB and they will need to be baked prior to assembly. If this is okay I would investigate the grnd layer that was mentioned. What is

Wave Solder Non wetting holes

Electronics Forum | Thu May 19 21:53:07 EDT 2005 | KEN

Is it possible your board is warping and skip plating? Have you run a lev-check? What does your contact patch look like? Do you have ice cikles (spelling???) or solder "flags". IF yes, your flux is consumed or nonexistant. What is your dwell time

FUJI Line vs MY15 line

Electronics Forum | Mon Jun 06 16:09:03 EDT 2005 | avalancher

Grant, As a MYDATA user, your comments worry me. You state that the MDYATA's are not stable or reliable? I am currently placing 0201's with the HYDRA head (at appx 15K/hr) with 0.01% fallout/bad placement. I also place a large range of fine p

A.O.I recommendation

Electronics Forum | Thu May 26 18:55:15 EDT 2005 | bakersm

I have been comparing Mirtec to Yestech on a regular basis. As a AOI trainer and installer, I have seen significant difference between the machines. 1. In a side by side comparison just today, using the same board, I found the following: a. Insp

A.O.I recommendation

Electronics Forum | Fri May 27 18:46:09 EDT 2005 | gregcr

I am almost hesitant to mention my good fortune with our Yestech system, for fear that our advantage in the industry will be known. We have run a Yestech for about a year, the operator interface is very well organized. Data is scanned on the machin

A.O.I recommendation

Electronics Forum | Sun May 29 11:42:45 EDT 2005 | Stephen

I will say that AOI units are not > magic boxes, you get out of them what effort you > put into them. Use them as process improvement > devices, not a magic machine to catch all your > mistakes. Mirtec's come close though, but you are right a

A.O.I recommendation

Electronics Forum | Thu Jun 02 11:22:13 EDT 2005 | Rob

Hi Kyle, Although I agree in principle with what you say, we were getting exellent solder joint inspection on reasonably high density boards (approx 1000 components from 0402 to finepitch QFP's). However obviously they wouldn't touch any form of BG


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