Electronics Forum: electronic (Page 5741 of 7890)

Should I panic over .5mm pitch BGA?

Electronics Forum | Wed Aug 31 11:02:28 EDT 2005 | Jason Fullerton

We are using one BGA that has 7 mil bumps on a 20 mil pitch. We use the manufacturer's recommended pad and aperature layout, which is an 11.8 mil square overprint on a 6 mil land. At 11.8 square, you need to use a 4 mil laser cut or a 5 mil e-form st

Component Loss in CP643

Electronics Forum | Fri Sep 02 14:15:44 EDT 2005 | Mika

Check the dimensions of the components in question with a caliper and put the correct numbers in Your part data. Check that the correct nozzle is being used. Also make sure that you have the right pcb height in Your program. This is somewhat criti

Component Loss in CP643

Electronics Forum | Wed Sep 28 01:32:15 EDT 2005 | Mika

Try vision type 12 for capacitors, this will give you much better acceptance in the vision inspection, since those are slightly rounded. Resistors works normally fine with vision type 10. If you have a component that is very hard to get pass the visi

Component Loss in CP643

Electronics Forum | Thu Sep 29 05:37:56 EDT 2005 | dougs

for 0402's you should be able to run the turret at full speed, if you need to slow it down it means that your machine isn't set up properly. use the vision number that the manual tells you and make sure your feeders are properly calibrated, poorly c

PCB manufacturer near Quebec, Canada

Electronics Forum | Thu Sep 01 18:27:28 EDT 2005 | Board House

Hi I currently Manufacture product for Dataradio Inc. in Quebec. and would be interested in quoting your product. We are a Multi-layer facility in Minnesota, we currenty manufacture layer counts between 2 & 18 layers. Line widths and Spacing down t

ROHS Line Conversion Process from leaded process

Electronics Forum | Fri Sep 09 17:41:58 EDT 2005 | Wild Bill

Reflow and wave flow solders have to be changed more often because of contamination. Pb free PCB's don't solder as well so you will likely have to find a new process or supplier. The higher temperatures heat soak the components so they all need to be

ROHS procedure's for handling PCB, Moisture sensitive dev. etc.

Electronics Forum | Fri Sep 02 05:17:54 EDT 2005 | pyramus

I have another question can anybody assist me. Is there any specific procedure or guidelines that need to be followed for handling PCB (OSP & Immersion Tin)? Moisture Sensitive Devices? or how about throw-out or left over parts? Is there any paste h

solder strength

Electronics Forum | Fri Sep 02 08:16:14 EDT 2005 | pjc

From Ray P. Prasad's article in this month's SMT magazine about the new IPC-7095 revison: ".....IPC does not have pull tests in any of its standards, and some reliability experts would prefer to keep it that way, pull tests are commonly used by some

solder strength

Electronics Forum | Fri Sep 02 09:02:10 EDT 2005 | dougs

you tell me, the customer has started to pull at some of the leads of some IC's with tweezers while de-bugging boards that had failed in the field, he was able to pull some of the leads away from the solder joints, we feel he may be over-doing it a

solder strength

Electronics Forum | Wed Sep 07 04:40:50 EDT 2005 | Slaine

i worked for a mobile phone base station manufacturer a few years back and they had a customer in Thiland who were complaing the cabinets we sent them were dented and marked, we investigated, improved packing and goods out inspection but still had th


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