Electronics Forum | Tue Feb 06 13:24:31 EST 2007 | stepheniii
Good afternoon, > > You have to use lead paste > since none-RoHS components won�t withstand > elevated temperatures. Solder paste manufacturers > offer a lot of transitional pastes designed > specially for mixed process. Ask your paste > suppli
Electronics Forum | Tue Feb 13 13:49:57 EST 2007 | coop
I am talking about an internal tray holder It holds two trays. the lingo doesn't really matter because if you say Internal tray feeder/holder the guys at philips will know exactly what you're talking about. I checked several refurb places and the onl
Electronics Forum | Wed Feb 07 07:45:50 EST 2007 | jax
Water soluble residues probably won't cause instant failures. The failures are most likely caused by excess paste being deposited on the center pad of the QFN. The excess solder keeps the part from sitting down in reflow and increases the possibility
Electronics Forum | Wed Feb 07 10:36:33 EST 2007 | mk
Wow JAX. Way off buddy, I promise!!!! This is real as have all my posts. As an officer of the SMTA Atlanta Chapter for the second term, I am familiar with the Forum Etiquette.. Thanks for defending our site's honor JAX. I don't like people who ab
Electronics Forum | Wed Feb 07 17:19:36 EST 2007 | stepheniii
We have been processing a family of boards for 3 > years. No issues. New PCB Vendor and the boards > suddenly will not print very well. Sloppy > printing definition. Closer inspection reveals > that the soldermask is built up .0012-.0019 over >
Electronics Forum | Tue Feb 13 11:20:59 EST 2007 | cevans MPM printer specialist
Off contact is generaly less favourable than on contact printing. print height becomes a issue towards the edge or foil clamps. If you Had little or no issues with your previous board vendor re-check your specs you supplied to your current vendor. If
Electronics Forum | Tue Feb 20 06:05:10 EST 2007 | mk
Thanks to all for the info. The ideas to correct the situation are all excellent and if we see any more boards from this source with this condition we will know what to do now. In the end however, the real questions we are trying to answer are, 1.I
Electronics Forum | Tue Feb 20 08:19:54 EST 2007 | Steve
One question about the build to print statement; is there some note saying that the vias are to be plugged with mask? If so, I'm wondering when the circle of mask was done over the vias. If it was done as a secondary operation after flood coating, t
Electronics Forum | Wed Feb 07 17:05:48 EST 2007 | dsoohoo
Thanks Russ and Dave. Russ- I was planning on thoroughly cleaning out the remainder of the low temp solder and going back to 63/37 for re-installation of a new device (our company does not ever re-use a device). Given these circumstances, would you
Electronics Forum | Thu Feb 08 04:38:47 EST 2007 | lupo
Hi everybody, Does anyone know how could be soldered shield (blindage) in SMT process ( SMT components inside), moreover that the SMT is double sided. I wonder how could be placed a component with H3xi21xL34 dimensions , and how capable will
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