Electronics Forum | Tue Nov 17 22:36:17 EST 2009 | rajeshwara
Hi All Plz help , we are manufacturer of Set Top Boxes , where we use ST BGA 5202 ,Paste : ALPHA METAL OM338-T45-LF & STENCIL : 4 MIL & we also tried 5 mil . Problem : At first Test BGA work fine but after some days Assembly dead functional and when
Electronics Forum | Thu Nov 19 02:22:12 EST 2009 | andrzej
Hi, we have an idea of running one side of PCB using 58Bi/42Sn solder to prevent glueing components on other side of PCB when board is on second run through SMT process. I wonder what issues we can meet once we try to use SAC305 when reworking some
Electronics Forum | Tue Nov 24 10:03:45 EST 2009 | andrzej
Actully none couse we glue them. Please see attached file - there are red dots marking glue placment. I understand you want to check if there is any sense in gluing components. I`ll ask one more time - Is anoyne who reworked SMDs with SAC305 where
Electronics Forum | Tue Nov 24 18:45:12 EST 2009 | gregoryyork
We put it in one flow soldering machine probably 12 years ago now worked really well but was extremely brittle you maybe better off with the 1% Ag alloy as its more ductile. Look at AIM Solders site if you want further information on the alloy Itis a
Electronics Forum | Tue Nov 24 05:23:18 EST 2009 | prodivegsr
Hi Davef, Thanks...Saw 1 of your thread that you posted : Thanks for providing... From davef : There are many possibilities: * Conformal coat is incompatible with surface residue on the board * Conformal coat is incompatible with solder mask on the
Electronics Forum | Wed Dec 02 10:14:42 EST 2009 | duso02
As a large coating house we use 1B73 daily and we have very few issues with bubbles. We very rarely bake it as the air cure is so short. Also, we only use thinner 73 vice 521. Another question would be; how is it being applied? How thick are you appl
Electronics Forum | Wed Dec 02 20:11:37 EST 2009 | prodivegsr
Hi Lou, we are using a fluid dispensing machine. our current requirement is around 50um. From the Datasheet,the thinner 73 has a higher evaporation rate of 1.0 comapring with thinner 521 at 0.6... does the higher evaporation rate eliminate the bu
Electronics Forum | Fri Dec 18 09:07:24 EST 2009 | tommyg_fla
dave, where I work they are having the same problems with 1B31 acrylic. The coating thickness is 6-8 mils dried so that have to do several passes with an air dry between them and a final oven cure. They think that it might be related to the heating r
Electronics Forum | Thu Nov 19 20:05:14 EST 2009 | davef
Density. There is a difference between lead (.410 lbs. per cubic inch) and tin (.254 lbs. per cubic inch). The same volume of tin-based solder, therefore, weighs approximately 1/4 less than a lead-based material. This adds up to more joints per pound
Electronics Forum | Sat Nov 21 12:28:00 EST 2009 | flipit
There is evidence of lead being used in soldering 5000 years ago in Mesopotamia. Not a big issue for most people doing SMT but the poster should also understand why percent metal is adjusted for different solder paste alloys. You print by volume b
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