Electronics Forum | Thu Jul 15 21:18:27 EDT 1999 | Scott McKee
| I'm designing a board where the parts will only fit if I do one of the following: | | 1. Put BGAs on both sides | | 2. Put BGAs on top, smt TSOPs directly underneath and using blind vias to keep the real estate on the bottom side below the BGA pa
Electronics Forum | Thu Jul 15 11:57:15 EDT 1999 | nards penalosa
We have been encountering diminishing ball shear readings these past few weeks, despite the fact that we did not change any ball shear tester parameter. Our reflow parameters are also within spec limits. ( 210-220 deg C max temp. and 40-60 sec dwell
Electronics Forum | Thu Jul 15 12:26:56 EDT 1999 | Earl Moon
| We have been encountering diminishing ball shear readings these past few weeks, despite the fact that we did not change any ball shear tester parameter. Our reflow parameters are also within spec limits. ( 210-220 deg C max temp. and 40-60 sec dwe
Electronics Forum | Thu Jul 15 15:55:41 EDT 1999 | nards penalosa
| | We have been encountering diminishing ball shear readings these past few weeks, despite the fact that we did not change any ball shear tester parameter. Our reflow parameters are also within spec limits. ( 210-220 deg C max temp. and 40-60 sec d
Electronics Forum | Thu Jul 15 10:28:49 EDT 1999 | Boca
| I'm looking into vision inspection equipment to automatically inspect SMD placement and solder joint quality. Does anyone have any recommendations or know of any commonly used equipment? Do other manufacturers use vision systems at their inspecti
Electronics Forum | Fri Jul 16 05:24:40 EDT 1999 | Chris May
| I'm looking into vision inspection equipment to automatically inspect SMD placement and solder joint quality. Does anyone have any recommendations or know of any commonly used equipment? Do other manufacturers use vision systems at their inspecti
Electronics Forum | Thu Jul 15 12:35:19 EDT 1999 | Earl Moon
| I use a Transition Automation Semi- Automatic stencil printer with laser cut frameless stencils. My solder paste is an SN63/PB37 RMA 291. I do not operate with in a controlled humidity enviroment. The room temp generally runs around 70 deg's but hu
Electronics Forum | Wed Jul 14 17:03:15 EDT 1999 | John O'Brien
I'm doing some basic research in trying to understand the purpose and drivers that cause bar code (or other) marking of PCBs. I would appreciate any knowledgable volunteers willing to speak with me -your name, number, the best time for the call- or r
Electronics Forum | Wed Jul 14 19:15:59 EDT 1999 | JohnW
| Can plcc's be glue on the a board if not why? | Ron, The biggest problem you have with PLCC's is the hieght of the base of the component from the board, if you can get a glue dot high enough then yes you could do it. Probably the best method is d
Electronics Forum | Sat Jul 17 17:42:02 EDT 1999 | Alain
| I have been recently playing the the different bump process within the Universal GSM part data software. Can anyone explain to me the differences between bump process A and E? Any feedback would be helpful | Hi, first of all, these were initiall
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