Electronics Forum | Tue Jun 04 20:34:28 EDT 2002 | russ
Jason, Excessive thermal ramp rates, misprints, improper pad design, paste type, placement pressure, all can cause solderballs. Do the pads on this board meet IPC 782 criterias? I have found that too much pad underneath component can cause this. A
Electronics Forum | Tue Jun 04 12:54:00 EDT 2002 | Bob
Hi, We are manufacturing a small PCB with large areas of gold plating. We experience from time to time what appear to be solder splashes on the gold areas. I do not believe the contamination to be from "outgassing" due to the distance from the dep
Electronics Forum | Wed Jun 05 15:09:44 EDT 2002 | cyber_wolf
I have seen this happen before it has been my experience that even one tiny sphere of solder form your solder paste will melt and spread out on your gold fingers. The particles are so small that they are not visible to the naked eye. If operators ha
Electronics Forum | Thu Jun 06 07:28:30 EDT 2002 | cyber_wolf
It has been my experience that the only thing(s) that will ever cause this is: 1. Operators with paste on their hands. 2. Paste on the screen printer tooling. 3. Paste on the bottom of the stencil. Even very very small amounts of paste on the gold fi
Electronics Forum | Thu Jun 06 11:42:24 EDT 2002 | Brad Jakeway
What you are seeing on your gold fingers is referred to as flux spattering. This is a very commond problem with gold fingers if you have a zero flux spattering criteria for quality control. The key to eliminating this problem is in the reflow profi
Electronics Forum | Wed Jun 19 00:07:10 EDT 2002 | kenbliss
arzucom, have you considered using trays to handle your boards in process and your handbuilds. This method is fast becoming the industry standard method for a large variety of reasons, specifically ESD as when the boards are in the tray your people
Electronics Forum | Wed Jun 19 00:07:31 EDT 2002 | kenbliss
arzucom, have you considered using trays to handle your boards in process and your handbuilds. This method is fast becoming the industry standard method for a large variety of reasons, specifically ESD as when the boards are in the tray your people
Electronics Forum | Wed Jun 05 17:14:40 EDT 2002 | davef
First, I suggest that people search the SMTnet Archives in just about every response that I make. Second, you need to work on your DOE jargon * Factors. Independent or input variables * Effects. Results. Dependent or output variables. Third, the
Electronics Forum | Wed Jun 05 17:13:58 EDT 2002 | Yannick
Hello! I have a strage problem, we made some production with uBGA, BGA, 0201, 0805, and other type of component. We didn't put the uBGA and 0201 and BGA on the board at the end of the line we look a our solder joint and surprise the solder made a
Electronics Forum | Sun Jun 09 19:02:15 EDT 2002 | Ken G.
Sam, I can tell you right now that if you have a low volume hi mix application where the program/job is changing every day, an AXI system is not going to be a good fit. As you alluded to, the programming time is onerous, the fine tuning or tweaking i
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