Electronics Forum: electronic (Page 7061 of 7890)

Black color solder wetting after reflow

Electronics Forum | Tue May 03 21:14:19 EDT 2011 | davef

Can we talk some to better understand the scope and breadth of the problem? * From your picture, it looks as if the problem shows-up on some pads, but not others. Is this accurate? * Is this lot related? * Is this related to a few items from a lot? *

Quad IVc Laser Align Extents

Electronics Forum | Fri May 06 09:33:22 EDT 2011 | jimlas53

RLM, you have been very helpful! Let me try this on you: We have two IVC's, one with a conveyor and Quadalign, the other with a workholder platform and Cyber-optic. I just ran the first successful assembly on this second system, but the extents had

First Off and P+P Data

Electronics Forum | Wed May 25 17:58:07 EDT 2011 | rssimmons

The SimmScope is a first article inspection system that uses an overhead digital microsope on a motorized gantry to inspect the board - much like an AOI - except that it does not automatically make the pass/fail decisions. It is up to the operator to

First Article Inspection, Lower End AOI

Electronics Forum | Wed May 25 17:48:31 EDT 2011 | rssimmons

The SimmScope is an inspection system that uses an overhead digital microsope on a motorized gantry to inspect the board - much like an AOI - except that it does not automatically make the pass/fail decisions. It is up to the operator to make the de

First Article Inspection, Lower End AOI

Electronics Forum | Tue May 31 16:31:02 EDT 2011 | xray

Hi, Besides the 2 machines mentioned which are part comparison machines that require the operator to provide a pass/fail on each ref id, there is a system called the FA Inspector which offers the mode described above and two additional modes: 1. Au

Stacking/piggyback chip.

Electronics Forum | Tue May 24 13:18:43 EDT 2011 | leemeyer

We had a Quad 4C that was fitted with a dispensing nozzle. It was perfect for jobs like this. Place the 1st component in the paste, add a dot or 2 of paste to the top of that part and then place the 2nd component on top. I beleive that you may be ta

ReFlow Vs Wave (using Red Glue) Soldering.

Electronics Forum | Thu May 26 11:21:14 EDT 2011 | asksmt

Hello Guru's, I am using IPC-7351 LP Calulator to design Footprint (0603, 0805, 1206, SOT-23, etc) for all SMT Parts. Our Production Recently commented that they have included Red Glue Machine inhouse and will use Wave Soldering for Both Thru-hol

Quad IIC - Can you use a Quad Align Board from S Series?

Electronics Forum | Tue May 31 14:23:16 EDT 2011 | gosswald

I bought an “as is’ Quad IIC package a while back. The machine definitely has issues with the Quadalign Board. The ICs were literally falling off of the board. I am guessing when it was manufactured they did not get the PC board quite hot enough or s

DPAK drop @Second reflow

Electronics Forum | Thu Jun 02 14:57:36 EDT 2011 | davef

We don't expect properly soldered first-side DPAKs to fall from the board during second-side reflow. The ratio of weight to solder surface area for a DPAK is 1.32 gm per in^2, which is well within the limit of 44 gm per in^2. [Search the fine SMTnet

estimate solder thickness

Electronics Forum | Tue Jun 07 10:38:34 EDT 2011 | davef

Boots: Here's several methods for guessing at the amount of solder on your connection: * First, 'Down & Dirty' ** Assume that the solder is flat, which is reasonable since it's 'flattened' by the component package ** Assume 100% paste transfer from t


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