Electronics Forum | Fri Aug 21 15:07:31 EDT 1998 | Dave F
| Any competition for Teradyne on this front? Any users out there with comments? | Thanks in advance. | G G: Does Teradyne make flying probe testers? Dave F
Electronics Forum | Thu Aug 20 14:49:25 EDT 1998 | Scott Cook
How about live scheduled chat via ICQ ( or other means)? Software is free for downloading. Guess volunteer host would be in order. Would not have to be topic specific necessarily.
Electronics Forum | Fri Aug 21 08:33:17 EDT 1998 | Dave F
| Will somebody please explain HASL (here). Thanks. Tryin': Check the following thread on SMTNet. Dave F Green coating and through-hole plating - Xingsheng 15:13:05 8/11/98 (3)
Electronics Forum | Thu Aug 20 09:47:46 EDT 1998 | Dave F
| Will somebody please explain HASL (here). Thanks. Tryin: HASL: Hot Air Solder Leveled. A board fabrication process that applies an oxidation preventing solder coating to copper pads on the board. Dave F
Electronics Forum | Thu Aug 20 09:10:25 EDT 1998 | John
We are looking at implimenting a bar code system for a SMT production line. To start we are looking at label printer/applicators. Are there any other companies that we should consider besides Zebra and Imtec?? Thanks for your input. John
Electronics Forum | Sat Sep 12 16:13:31 EDT 1998 | Tom Jura
| We are looking at implimenting a bar code system for a SMT | production line. To start we are looking at label printer/applicators. Are there any other companies that we should consider besides Zebra and Imtec?? Thanks for your input. | John You
Electronics Forum | Wed Aug 19 19:16:43 EDT 1998 | Steve
How is the aspect ratio of a reliable BGA joint defined? Is it best to have H/W between two limits? What are these?
Electronics Forum | Fri Aug 21 15:03:42 EDT 1998 | Dave F
| How is the aspect ratio of a reliable BGA joint defined? Is it best to have H/W between two limits? What are these? Steve: People on TechNet have spent alot of time talking about BGA pad design. Use the link below. Dave
Electronics Forum | Wed Aug 19 13:25:18 EDT 1998 | Claude Clerc
I'm searching after a documentation about the jumpers of the motherboard v4p895p3/smt v1.0. Do you want to send me one, please ? Thanks Claude Clerc
Electronics Forum | Wed Aug 19 06:40:06 EDT 1998 | G Thomas
Require a conductive adhesive - either isotropic or anisotrpic - which can be used for 100micron oitch devices. Must be resistant to solvents such as MEK and acetone. Cure below 150C, with possible potential for rework of the conections.
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