Electronics Forum | Fri Dec 08 11:30:19 EST 2006 | ganoi
We discussed about applying 2 dots of glue on either sides of the LED body, but have yet to try it out. Other discussions include conductive adhesive, using fixturing with weight, different stencil aperature design, hand soldering.
Electronics Forum | Fri Dec 08 11:56:23 EST 2006 | russ
Wouldn;t the glue hold the part up?, usually a glued part has much higher standoff than a soldered one. Russ
Electronics Forum | Fri Dec 08 12:13:22 EST 2006 | ganoi
Sure would. We discussed applying the glue on the sides rather bottom of the part. Hopefully the seating of the part during P&P helps push it down. Certainly there will be still some gap as some of the glue will be under the part. Each experiment off
Electronics Forum | Thu Dec 07 15:12:41 EST 2006 | samir
Patrick, What's the latest buzz over the pond? Is the EU forming a committee to "re-think" this hole RoHS deal - and (wishful thinking) - cancel the whole thing and let everyone start soldering with good ol' tin/lead again?
Electronics Forum | Thu Dec 07 21:06:20 EST 2006 | davef
You can put Mantis ISIS Microscope Eyepieces on most microscopes. Why not: * Buy good used microscope * Add Mantis ISIS eyepiece Alpha stereo microscopes are good, but there's plenty of good stereo microscopes out there [eg, Nikon, Olympus, Bausch
Electronics Forum | Fri Dec 08 01:05:33 EST 2006 | Setup Guy
Hi Guru, I have a project to evaluate different kind of Solder Bar and Flux to be used in wave solder(RoSH)machine, to choose in which is the best to be use. What is your best practice to evaluate the Solder Bar and Flux ? Cheers, Setup Guy
Electronics Forum | Fri Dec 15 07:45:17 EST 2006 | realchunks
The best practice is to perform a design of experiments. Without knowing your product or board composition, it is sensless to recommend any flux or solder. Contact some local area wave solder sales people. There are also "no lead specialist" that
Electronics Forum | Fri Dec 08 09:48:11 EST 2006 | SMTRework
Hi Guys / Gals, just curious as to how some of you approch BGA pad damage? (ie broken or lifted pads) Also, what kind of success rate have you found with your method?
Electronics Forum | Fri Dec 08 13:25:18 EST 2006 | SWAG
We have a heavy carrier that results in belts spinning out when our GSM attempts to transfer it to the centernest. Can the belt transfer speed be slowed down on GSM? How???
Electronics Forum | Mon Dec 11 08:52:11 EST 2006 | beta
Hi, I checked out your component.They are differnet dimensions. You say you are not using the recommended overprint ? if this is the case, I would imagine that is your problem. If you want to contact me off line to discuss further plesae feel free.
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