Electronics Forum | Wed Mar 25 11:09:08 EDT 2020 | sumote
Have you measured and input the "Distance To Image" setting correctly? If that number is off, you will get that error.
Electronics Forum | Tue Mar 31 09:25:18 EDT 2020 | emeto
If you believe your picture is in the middle and is not skewed, than go to your basics and recheck your fiducial locations and detection. Sometimes these machines recognize something around and give you this error. Try program with isolated pads and
Electronics Forum | Thu Mar 19 11:44:03 EDT 2020 | svajunasastrauskas
Hello, can someone share good practise how to calculate how many percent solder paste can be applied on solder mask for better solderability (by increasing stencil aperture). In eg, aperture is increased 30 percent, could it be more? Where find this
Electronics Forum | Thu Mar 19 15:01:00 EDT 2020 | emeto
Overprinting until the solder paste start detaching from the joint and start forming solder balls. Based on finish, chemistry and type solder mask this number will be different.I also wouldn't call it "better solderability".
Electronics Forum | Fri Mar 20 09:29:27 EDT 2020 | slthomas
If you just want a little more paste and don't care where it ends up I guess percentage is OK, but if you're trying control where it ends up it makes sense to specify how far, and in which direction(s).
Electronics Forum | Tue Apr 21 21:49:26 EDT 2020 | SMTA-Samy
Why are you trying to overprint? Take some time to review this presentation by Chrys Shea titled SPECIFYING STENCILS TO OPTIMIZE PRINT PERFORMANCE. https://www.smta.org/chapters/files/Uppermidwest_Chrys_Shea_Presentation_Upper_Midwest_Expo.pdf
Electronics Forum | Thu Apr 23 07:34:15 EDT 2020 | stephendo
Stencil editing is something that you have to do to do well. And you have to look at the boards after the screen printer and after the oven. Reading white papers ain't gonna cut it. And then there will always be part pad combos that will introduce s
Electronics Forum | Thu Apr 30 23:21:52 EDT 2020 | SMTA-Davandran
I am seeing a lot of solder ball for PIP process. is it due to the paste height go beyond 0.2mm.? what is the DOE need to focused for PIP process?
Electronics Forum | Thu Apr 30 23:28:17 EDT 2020 | SMTA-Davandran
Do considering AR and 5 balls rule during designing stencil aperture. it give better paste release. Aperture redesigning need to look into symptom that we are seeing on AOI. It will be given us idea hows to improve aperture design to improve SMT firs
Electronics Forum | Fri May 01 13:23:14 EDT 2020 | stephendo
It could be the paste or the profile. (or something else) You should try changing those one at a time. Also maybe try less paste and using preforms.
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