Electronics Forum | Wed May 20 07:31:06 EDT 1998 | smd
I pretty much have my old DI water problems solved, but now (of course)I have new problems: I was monitoring the degradation of water quality to see how long it would take to get down to 2.05 Megohms (is this too high to change the tanks?-it's prett
Electronics Forum | Wed May 20 10:51:40 EDT 1998 | Alan
| I pretty much have my old DI water problems solved, | but now (of course)I have new problems: | I was monitoring the degradation of water quality to | see how long it would take to get down to 2.05 Megohms | (is this too high to change the tanks?-
Electronics Forum | Wed May 20 08:38:51 EDT 1998 | Jerry
We have had really good luck with the IIT version. We use it with a DEK265 also. I am having trouble coming up with a brochure but their email address is iit@ns.net. We have ordered probably 10 to 15 stencils for use on prototype builds. We have
Electronics Forum | Mon Jun 08 08:49:14 EDT 1998 | Michael
| Does anyone have a phone number for Topline. I am looking for some dummy components, qfp132s specifically, and their website seems dead and the only number I hve for them is disconnected. | Thanks, Gary Gary, Just a quick note, TopLine filed cha
Electronics Forum | Mon May 18 13:18:25 EDT 1998 | Chrys
I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and soldera
Electronics Forum | Mon May 18 22:55:36 EDT 1998 | Jerry
Earl, I admit that I missed your article since I seemed to have let my subscription to Circuit Fabrication Magazine expire. I am interested in your experience in this area. Is there a way to get a copy of your paper? Could you maybe post it to a w
Electronics Forum | Fri May 15 04:06:33 EDT 1998 | Alan Pestell
We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin packages. How d
Electronics Forum | Thu May 14 15:23:49 EDT 1998 | Matthias Mansfeld
Does anybody know a (if possible low-cost) system which can travel with the PWBs through a reflov oven (like some temperature profile loggers) for measuring the residual oxygen? My problem is, it is a batch oven which does not allow to have any pi
Electronics Forum | Fri May 15 18:02:25 EDT 1998 | Earl Moon
| I would like to hear any feed back concerning the Slim-Kic prophet system. | Does it deliver what is promised? | From what I can tell from the demo its a great idea. | Please let me know what you think | Mike Mike, Again, the thing works when enoug
Electronics Forum | Wed May 13 14:22:17 EDT 1998 | JoSi
Hi, There has been a lot of disputes in our company about changing present HASL to another Finishing which can provide more flatter pad surface in fine pitch applications. ( perhaps Ni/Au, OSP ) The target is to reduce solder defects, thus improve
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