Electronics Forum | Thu Sep 04 10:03:13 EDT 2003 | Rick B.
I'm attempting to develop paste in hole process so that I can reflow a few plated through hole components on a mixed tech board. Tried various pastes, profiles and stencil thicknesses. Would appreciate any insights and/or pointers anyone can share on
Electronics Forum | Tue Sep 23 13:00:38 EDT 2003 | Pete
I have seen a few around in PA. Customers seem to like them. Comments I heard was that they're better on smaller components but not so good on large UFP. Mirae (Korean company)is the OEM for the Quad Meridian. Mirae is back with Tyco/Quad for distrib
Electronics Forum | Fri Jul 22 10:44:20 EDT 2005 | Phil
we have two 1030 and two 1030p. Great for customizing and making changes on the fly. Although support from Mirae is non- existant, in fact trying to find anyone from that company who knows anything is a joke. Tyco seems to have the only qualified
Electronics Forum | Thu Sep 04 12:07:18 EDT 2003 | cyber_wolf
Hi all, We recently purchased an Omniflow 10 and I am setting up some new recipes. I am told that you can crank the belt speed up pretty fast on this oven. The recipe I am working on now has a belt speed of 30 ipm. What should I have the belt speed
Electronics Forum | Sat Sep 06 21:50:09 EDT 2003 | Hoss
Sr. Assuming you are processing the garden variety 63/37 paste on FR4 substrates, a good starting point is to plan for 3.5 to 4.5 minutes of process time on the board. If you measure the total heated length of your oven and you use the range above,
Electronics Forum | Thu Sep 04 16:44:19 EDT 2003 | mleber
We are a military contractor running mixed technology CCA's. We currently "map" all defects off reflow and wave by indicating the defect on a map (plot from gerber) then passing it on to rework. The map is used for SPC data as well as overall perform
Electronics Forum | Fri Sep 05 16:36:50 EDT 2003 | mleber
We handle this issue by adding a .1, .2 etc after the existing rev. Ex. Rev is A - we do an internal Rev changing an item and it goes to Rev A.1 - Basically you are building a Rev A with that ECO applied to it. It works well but you need to pay atte
Electronics Forum | Mon Sep 08 11:30:54 EDT 2003 | clarkk
A customer recently questioned our use of the EIA curves for derating SMT devices for increased ambient temperatures. The European method (CECC) is much more severe in derating power ratings of devices as temp increases, but there are differences in
Electronics Forum | Tue Sep 09 18:07:18 EDT 2003 | davef
We would be very wary of allowing 50 uinches, because this will likely result in reduced shelf life due to intermetallic growth. As a guesstimate, at least 10 uinches of that 50 uinches, and maybe more, is already intermetallic when you receive the b
Electronics Forum | Fri Sep 12 09:10:23 EDT 2003 | Norm Morikawa
Around 1989 I had this probelmm with a SMT CCA that would not solder in one area consistently. I had it cross sectioned by the bare board supplier and found that under their metallurgical microscope the thickness of this HASL bare board could not be
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