Electronics Forum | Fri Feb 06 14:08:56 EST 2004 | Andrea
We consider two screen printer from MPM and it is type SPM and MicroFlex. How you compare these two machines. Our the smallest fine pitch is 0.5 mm QFP. Is it really worth to buy SPM or MicroFlex will handle with it without any problems.? And what ki
Electronics Forum | Mon Feb 09 08:47:33 EST 2004 | davef
Paragraph 7.3 of ISO 9000/2000 seems to say that you must have such a process. Developing this process from scratch will be very painful. Consider employing a seasoned veteran. Look here for Earl Moon�s DFM book: http://www.pcbspecialist.com/Epoddfm.
Electronics Forum | Tue Feb 10 14:45:06 EST 2004 | patthemack
I have an old De Haart printer that has a problem. It will not reset either the z axis or the squeegee. The z axis just gyrates, and I think it's trying to get to the zero position, which is all the way down, but it's already down. Is there a De Haar
Electronics Forum | Fri Feb 13 04:09:52 EST 2004 | patthemack
New update: By playing around with some settings in the software, we've been able to get the z-axis to work. This makes me think that if we reload the software, the problem may be fixed. Got any ideas as to where I can get a copy of the MPC-29 softwa
Electronics Forum | Thu Feb 12 21:06:20 EST 2004 | davef
"LGA" [land grid array] is a pretty broad topic. Search the fine SMTnet Archives for background on: * BGA * uBGA * Flip chip * etc Consider: * Area Array Packaging Handbook: Manufacturing and Assembly; Ken Gilleo; McGraw-Hill Professional; 1st edit
Electronics Forum | Thu Feb 12 12:03:02 EST 2004 | pjc
The reality is mfg jobs worldwide are going down down down. In fact Asia lost way more mfg jobs - in terms of numbers, not percentage - than NA and Euro. The fact of the matter is less and less people are needed to make more and more products. Pretty
Electronics Forum | Thu Feb 12 17:14:49 EST 2004 | Jim
Replying to mine own thread for clarification. We are having some issues with solder mask shifts on memory boards using fine pitch BGAs. At times the etch to etch distance does not leave room for a solder mask annular ring to be shifted or it will c
Electronics Forum | Thu Feb 12 10:19:46 EST 2004 | Bryan
Hi all, These days our customer asks us to figure out ,during reflow,the BGA ball and solder paste,which will first melt? I think it's very hard to get the rusult.coz I think it'll vary at diffrent part of the BGA,and how can this affect the perf
Electronics Forum | Fri Feb 13 11:46:23 EST 2004 | Jack
Is your customer trying to reduce voiding? If the device is using Sn90 / Pb10 and the paste is Sn63/Pb37 the board will melt first. However, if both solders are 183C eutectic, it's a tossup? PCB design, copper weight, bga type (pbga, micro bga, Tbg
Electronics Forum | Thu Feb 12 14:26:22 EST 2004 | Kris
Hi all, We have a PCB without any BGAs on it which goes into harsh environment.We therefore conformal coat it. After assembly the PCBs are expected to withstand "85degc/85%RH for 1000 hours" We now want to add a BGA to the PCB. Does any one have
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