Electronics Forum | Mon Aug 11 07:27:32 EDT 2008 | eyalg
We had experienced two (2) A BGA which fail (detached) off the board. Surprisingly we noticed that most of solder joints remains on the board leaving perfectly exposed and clean pads on the on BGA package (virgin pads) . Note: No mechanical stress wa
Electronics Forum | Mon Aug 11 10:45:04 EDT 2008 | eyalg
I assume you mean the balls of the BGA, not pads > (laugh it up guys - I said balls). If so, you > may have a no-lead BGA or a high temp BGA. hi I mean that the the balls were left on the board and the BGA pads were found clean. What do you
Electronics Forum | Mon Aug 11 10:47:40 EDT 2008 | dphilbrick
Sounds like bad BGA's to me. I suspect this is rare but you can get black pad on the BGA attach pads just like you get them on a PCB. Do you have un-processed BGA's?(still in package) I would have one tested (not by the manufacturer)!
Electronics Forum | Mon Aug 11 10:35:32 EDT 2008 | realchunks
What does your top side wetting look like? This is a perfect case where top side wetting will tell you when you have a good joint. Without seeingor knowing your process, I would suggest either more pre-heat or longer dwell in the solder. Either on
Electronics Forum | Tue Aug 12 08:35:28 EDT 2008 | avalancher
Many years ago... my old engineer used a very simple unit bought at Radio Shack. It was a device that they use in door ways to announce someone was entering the store. It used a beam of light and when the board broke that beam, a bell/ring/noise wou
Electronics Forum | Tue Aug 12 15:34:37 EDT 2008 | grics
That is very interesting... I am curious though, why wasn't a plain blind rivet used? You probably can, but personally, I would be not want a solder joint holding the frame and the pcb... Mechanical stress on solder joints often leads to not good re
Electronics Forum | Wed Aug 13 09:20:05 EDT 2008 | wrongway
we tested this kind of part about 3 years ago did a few prototypes I did'nt know how it was going to work but our old amistar picked it and placed it just fine used a small nozzle with a o-ring on the end of it I think it did ok going across the wav
Electronics Forum | Wed Aug 13 22:23:24 EDT 2008 | davef
8.4 * SAC305 => 7.36 * Sn-3.5Ag => 7.5 * '....in' [96.2Sn-2.5Ag-0.8Cu-0.5Sb] => 7.39 * Sn-4Ag-0.5Cu => 7.39, 7.44 * Sn-3.8Ag-0.7Cu (Multicore solder) => 7.5
Electronics Forum | Fri Aug 15 10:23:56 EDT 2008 | ck_the_flip
Ovens, and any other process for that matter, will ALWAYS vary. It's called process variation. I do Cpk (process capability) on my ovens. I track time-above-liquidus and peak temperatures. Statistics will validate how repeatable your oven is.
Electronics Forum | Tue Aug 19 08:16:21 EDT 2008 | grics
Nothing really... I guess my dry sense of humor doesn't translate very well through the forum... When you said MOSTLY that would seem to mean that you are more than 50% chinese, which I guess is possible. Sorry for not being funny. I will make sure
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