Electronics Forum | Sat Jul 22 14:50:04 EDT 2017 | spitkis2
It depends on the thermal mass of your assemblies (boards and components). Generally, if boards are small with few layers, the additional mass of components may have a significant impact on reducing the peak temperature. If boards are larger with s
Electronics Forum | Tue Jul 25 09:30:08 EDT 2017 | cyber_wolf
"We use Mistral 360 with glass top where you can "see" your process while board pass through the oven, you see when the paste dry, you see when the reflow starts, what is the time above liquid etc etc, and can adjust up or down with few degrees in ea
Electronics Forum | Tue Jul 25 12:46:14 EDT 2017 | emeto
This is easy experiment. Just run no populated PCB and that a populated one using the same spot for your thermo-couples. If you have a convection oven, you might be surprised how small this difference could be if not none. In some cases, I would expe
Electronics Forum | Mon Jul 24 07:18:51 EDT 2017 | jamesbarnhart
IPC has updated assembly standards for IPC A-610 and IPC JSTD-001 making them easier to use and adding information in areas that have evolved. Both IPC J-STD-001E and IPC-A-610E have also been more closely linked to eliminating the differences that c
Electronics Forum | Tue Aug 01 09:49:53 EDT 2017 | dontfeedphils
Our Engineering team handles all initial programming and debugging of programs on the floor, with a person "specializing" in a certain area, but with all Engineers cross-trained well enough to take on the job if need be. Technicians are responsible
Electronics Forum | Sat Aug 05 00:25:26 EDT 2017 | jlawson
Koh Young can also import ODB++ files, ALL major EDA tools offer ODB++ export, Mentor EDA tools for sure, Cadence, Altium, Zuken all offer ODB++ export...This has Part entities included as well as graphic data etc - is a full product data model. Can
Electronics Forum | Thu Aug 10 04:20:37 EDT 2017 | Alexei
Hi, We have solutions for your problem that used by many our customers. You can read about our tooling products (see QPlace, QPlace UPD and QPlan) on our website: http://www.proventustech.com. Also you can contact me through email: alexeis@proventu
Electronics Forum | Tue Jul 25 14:30:04 EDT 2017 | emeto
Looks like you have a great wetting of your paste :). Once body has been in contact with molten solder, the package could suffer damages on the body(outside and inside) and on the circuitry inside. It is considered a defect. I have seen that before a
Electronics Forum | Tue Jul 25 16:59:54 EDT 2017 | spitkis2
Is anyone reworking BGA parts with an rf shield on top of the package? Any problems getting it off the board? I am running into an issue in that the shield comes off but the part remains on the board - not because solder has not reached melting but
Electronics Forum | Wed Jul 26 11:13:06 EDT 2017 | jdengler
It can be done and is done all the time. You need to check with your customer about this since you will not have clean square corners along the edge. If they are snapping the boards into a holder they may need the square corners to securely hold th
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