Electronics Forum | Mon Oct 25 16:12:52 EDT 1999 | Joe
Dave: Thanks for the info, I appreciate it. You start off by naming a +/- 2 sigma process, is that equivalant to an AQL of 0.25 ? What is a 6 sigma equivalant to? You mentioned the AQL at incoming inspection, what should that be in relationship to
Electronics Forum | Mon Nov 08 09:30:15 EST 1999 | John Burris
I just wanted to thank all of you who responded via e-mail to me regarding this subject. After a lot of looking and talking, I decided to keep using Unicam. I'm working on adapting my use of UC to fit my process a bit better, and hopfully, more effic
Electronics Forum | Fri Oct 22 11:37:38 EDT 1999 | Brett Gordon
Working DFM SMT issues with respect to a client's artwork together with a heavily modified solder stencil, I was able to reduce 0402 tombstoning from 80% across the board to 3%. I winged the aperture reductions, but are there any "rules" or guidelin
Electronics Forum | Fri Oct 22 21:23:59 EDT 1999 | se
Tombstoning is usually oven profiling, see October 14 thread below. Aperture rules are misleading. Component mix, stencil thickness, paste factors, all contribute. Also, are you making the stencil from a paste or pad layer or from a soldermask layer?
Electronics Forum | Fri Oct 22 07:24:11 EDT 1999 | Chris May
We are not into BGA Tech (yet !), but I was discussing other issues with a knowledgable individual, who said that they do not reball BGA's. What they do, is to have a piece of glass, apply some flux to the glass and then drag the BGA across the glas
Electronics Forum | Thu Oct 21 10:21:54 EDT 1999 | Brian
Cliff A half-question/half suggestion. In the thread about whether gloves are necessary on the SMT forum, I replied but, because I considered that the subject is much more far-reaching than the original poster thought, I ticked other forums, as well
Electronics Forum | Thu Oct 21 11:32:15 EDT 1999 | John Thorup
Larry Elaborating on the specific question, yes, the volatile solvents in the flux can and will evaporate. Evaporate completely in any reasonable amount of time? Probably not. What tends to happen is that the exposed paste dries on the surface and
Electronics Forum | Fri Oct 22 10:35:56 EDT 1999 | Graham Naisbitt
Armin, I can supply you but wont. Why not? Because these materials have a short shelf life when packed into syringes. Your local supplier should be able to provide them but he will be obliged to make up a batch of 2 - 300 to be economical - but they
Electronics Forum | Wed Oct 20 16:55:26 EDT 1999 | NickMata
Hello all, I am trying to get some information on ENTEK CU56. I am planning to use 310M flux on ENTEK 56 cards. It will not be a double reflow (top/bottom) followed by wave. I plan to reflow, glue/cure then wave. I am concerned about burning off the
Electronics Forum | Wed Oct 20 19:36:45 EDT 1999 | Dennis O'Donnell
Hi Mark: Running a wire under a BGA is possible, however if you plan to mount the BGA over the wire you would want to make sure that the wire insulation will withstand the heat of the reflow temperature. A more reliable way would be to lay a trace
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