Electronics Forum | Mon Jul 14 12:24:02 EDT 2003 | MA/NY DDave
Hi So Steve, I must have missed something from your last subject topic. "solder fillet peeling" Are you saying you or they, Ultrasonic Clean for 20 to 30 minutes after soldering and that is suspected as causing the cracking at the top of the compo
Electronics Forum | Mon Jul 14 16:26:58 EDT 2003 | slthomas
Yes, they do the cleaning, we did the (apparently first) inspection and caught the problems. They tried a shorter cleaning cycle, witnessed no defects, and attributed the defects on the boards we had to their cleaning process. Now they just plan on
Electronics Forum | Tue Jul 15 11:18:29 EDT 2003 | slthomas
It is an interesting situation....one that merits as much business philosophy analysis as technical analysis. I'll be getting my official 60 day notice today. Any criticism about our overseas suppliers (that were selected by sr. management w/o in
Electronics Forum | Fri Jul 11 09:58:18 EDT 2003 | Chris
Good Day Everyone, We are a contract manufacturer. We are constantly receiving MSD components in consignment kits that are not sealed, not in the right bags or have no desiccant. When this occurs, we bake the parts per JEDEC J-STD-033A. We recently
Electronics Forum | Mon Jul 14 11:09:59 EDT 2003 | samaniegocesar
Hello to all. I have problems with IP1 Fuji machine, the machine was working properly and suddenly appear the erroc code 000C error task 0028 and error address F92228A0, I turn off and On again, I erase the memory but I have the same prblem, I can n
Electronics Forum | Tue Jul 22 06:41:40 EDT 2003 | davef
bga void doe * Dr. Lee at Indium Corp. has conducted a number of investigations concerning solder joint voiding and BGA components. Check Indium's site. [As an aside, Lee's book "Reflow Soldering Processing and Troubleshooting SMT, BGA, CSP and Flip
Electronics Forum | Wed Jul 23 05:47:53 EDT 2003 | iman
Yo Thanks! right on the money pad, the pinhole occurs mainly in the (fillet's) top-surface central of the whole solder (fillet surface) area. Like you said, large surface area, lowest surface tension. that's a possible cause, that the potential voi
Electronics Forum | Thu Jul 17 16:07:23 EDT 2003 | davef
So, how do you know it's "oxidation"? If the parts didn't solder, why aren't the parts the problem? Do the parts take-on solder? Please describe: * Appearance of the post-solder components. * Scope and extent of the problem. * Appearance of the po
Electronics Forum | Wed Jul 23 08:37:02 EDT 2003 | davef
Your fabricator should be able to re-apply the imm tin very easily. Actually, if we had boards like you describe [and we were sure we didn't mess them up], we'd be be making strong implications that our fab would need to make this right. Don't pin
Electronics Forum | Thu Jul 17 17:39:08 EDT 2003 | slthomas
If you wanted to use ultrasonics to wash an customer's assembly, and you'd had poor success doing it in the past, would you consider it reasonable for the customer to request that YOU provide cross-sectional image analysis of the first batch of new p
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