Electronics Forum | Wed Apr 07 09:59:23 EDT 2004 | Evtimov
Hello! We created a machine with full vision recognition system and we want to improve our calibration methods for centering the camera. What is not clear is how can we center the camera against the center of the nozel? I know you all use different k
Electronics Forum | Wed Apr 07 11:36:41 EDT 2004 | stefwitt
Your machine will have to have a reference position. From this reference position, you determine all other machine positions. If the camera is attached to the head, you could place a glass slug and measure camera-nozzle offset, by placing the slug w
Electronics Forum | Thu Apr 08 23:08:56 EDT 2004 | Ken
Well, the precision glass is for upward looking camera's. It essentially is a "perfect part". Vapor deposition lithography on glass (for Cte stability)....basically the part pattern (or part fids) is compared to its target location (same pattern on
Electronics Forum | Wed Apr 07 09:54:32 EDT 2004 | Dreamsniper
Hi Guys, Can anyone help me in providing their experience in process related problems with regards to the above equipment? I noticed that it's slightly different with the wave soldering. Wave Process: Apply Flux, Pre-heat then Solder Selective Sol
Electronics Forum | Thu Apr 08 14:21:31 EDT 2004 | mnguyen
We are looking to buy a insertion line TDK AC-7 Axial machine and a VC-7AT Radial machine. I am curious if there are any software out there that can program the machines. Spoke with Aegis and circuitcam and they told me they do not have any software
Electronics Forum | Mon Apr 12 08:10:17 EDT 2004 | wgaffubar
We are sometimes, not always, seeing very large voids in the solder joints of BGA's with Via in Pad. Some lots of PCB will have the voids and other lots of boards will not. I feel the via's are outgassing during reflow, due to the PCB not having been
Electronics Forum | Tue Apr 13 10:30:52 EDT 2004 | Ken
Threre has been speculation as to voiding as a function of solder paste liquiduous vs. ball liquiduous. Gas entrapment is thought to result if one melts before the other (I forget which order). Two profiles may yield different results as determined
Electronics Forum | Mon Apr 12 11:32:47 EDT 2004 | Luis Lazcano
Can you share some information on the hazardous materials and cleaning details for your manufacturing processes, please ? These are the questions I need to ask you: 1. Do you use brominated fire retardant in PWB material? If not, what other type
Electronics Forum | Tue Apr 13 14:14:59 EDT 2004 | russ
I have actually printed this same condition with type 3 paste Alpha WS709. I posted this for discussion and cannot remember what I called it. We did need to clean the stencil after every three prints. I did not check volume on these locations but
Electronics Forum | Thu Apr 29 17:35:17 EDT 2004 | Shinmoto
Hi there, We place FBGA packages on a lot of our memory modules. Our stencils have .013" square apertures and a .005" foil thickness. We are using a type 4 paste from Senju Comtek. The price difference is not that significant and readily available
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