Electronics Forum | Tue Feb 01 14:26:34 EST 2005 | rabell
I agree re; "always will be some assemblies that must be repaired". This is unlikely to lessen in the near term with an imminent move toward Lead-free. We are currently working with Cookson, PACE, and BEST developing a course in lead-free rework wh
Electronics Forum | Mon Jan 31 13:48:22 EST 2005 | John S
We have a line using the DEK Pump Print process. We use a 3mm plastic stencil and print adhesive through it. The adhesive we use is Heraeus 955. We've struggled with adhesive contaminating the pads of our smaller components. The deposit isn't on
Electronics Forum | Fri Feb 11 18:59:21 EST 2005 | primus
We have been using Tape and Reel on our GSM for the SOIC-8 packages for a while, and it's working pretty well. Less operator error, less reloads, less jams (provided you take good care of the feeders) and LESS TUBES STUCK IN MY VCD SEQUENCER!!! I hav
Electronics Forum | Wed Jul 06 09:36:22 EDT 2005 | dougs
aj, what do you do if your customers engineers cant be bothered sorting out the CAD data, or if you tell them you need it in a certain format and it just keeps coming in the same way anyway, we can't rely on our customers ( or some of them in partic
Electronics Forum | Fri Feb 18 09:06:33 EST 2005 | russ
This is what we use. 1. we only reball when we experience a manufacturing defect (short, trapped component, etc...)and if the part is expensive 2. No testing is done prior since we only reball parts that have a defective attachment. 4. The reliabi
Electronics Forum | Wed Feb 02 20:00:48 EST 2005 | davef
150*C/min * Determining the distance it takes to lower the delta temperature at the current conveyor speed: [150*C/min]/[25 inch/min] = 6*C/inch * Calculating how much of this 6*C/inch would be spread along the length of the 0805 capacitor: [6*C/inch
Electronics Forum | Thu Feb 03 04:55:21 EST 2005 | Dougs
OK, component wide portion runs with the conveyor, so really both sides should heat and cool at the same rate. The crack is at the termination between end cap and ceramic body and run vertically up the end cap, so when we remove the cap it comes of
Electronics Forum | Thu Feb 03 12:21:15 EST 2005 | Chunks
Lets get to the simple things. Wave or Reflow? Wave soldered parts have a higher susceptibility to physical damage until they are waved. That�s were I normally see this type of break. Usually, the crack is a circular pattern in the cap if it�s fr
Electronics Forum | Mon Feb 07 08:34:46 EST 2005 | Dougs
we are still looking into possible causes, we have rigged up a test to determine whether the cap is cracked and have ran a controlled batch off of SMT, these were all tested and look OK. I'm looking into buying some small strain gages to place over
Electronics Forum | Wed Feb 02 11:10:07 EST 2005 | jdengler
Hi AJ, I've never used the Flexa due to the price. We replaced our MCS with eSMT Software (web site http://www.esmt-software.com/). You might want to look at this if you don't need all of the Flexa features. We have older Fuji equipment (GSP's
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