Electronics Forum | Wed Oct 31 03:35:41 EDT 2007 | meritajs
Hello All, We have problem with one from our YAMAHA SMT mounter. It had weard defect. It gives error message"soft limit X over" when next step must pick up with head3. But all coordinat for next component do not exeed movable range. This failure happ
Electronics Forum | Wed Oct 31 16:56:11 EDT 2007 | glenearl
Has anyone ever looked into the possibility for laser marking 1812 size X7R ceramic chip capacitors injecting sufficient energy to cause cracking when voltage is applied? If so, what were the findings? We are having failures of caps from one manufa
Electronics Forum | Thu Nov 01 14:40:26 EDT 2007 | ck_the_flip
Electrically testing components is an age-old practice of the past. True "world class manufacturers" like to minimize, or even eliminate incoming inspection of ANYTHING - the theory being....a world class manufacturer should have such awesome relati
Electronics Forum | Thu Nov 01 22:19:57 EDT 2007 | lvzhu
The solder that we used is kester EM918 and Multicore LS328. Our printer machine is DEK-photon, this machine has supply below 300mm/s. the datasheet solderpaste of speed range is 30 to 150mm/s. when we produce the keyboard of the moble phone, this bo
Electronics Forum | Mon Nov 05 13:33:08 EST 2007 | slthomas
Heck no, I mean we print relatively slower on complex boards, as in 1 inch/sec (25.4mm/sec), and maybe 2 inches/sec. (51mm/sec) on less complex boards. SMT is not a bottleneck in our plant and printing never the bottleneck in SMT, so I see no need t
Electronics Forum | Thu Nov 01 16:26:49 EDT 2007 | kpm135
We have the BGA100 tool. It has its uses. Its nice to see if the balls on a BGA have collapsed and reflowed properly. At the same time though you can only see the balls around the edge of the BGA. It can also be dificult to position the device to see
Electronics Forum | Tue Nov 06 07:34:26 EST 2007 | scottp
I'm not sure what kind of marginal joint you're trying to identify, but when we went through a serious ball-in-cup problem a few years ago we tried hot & cold functional test as well as a day or two of -40/+125C thermal cycling and all were pretty po
Electronics Forum | Fri Nov 09 19:31:43 EST 2007 | yshiau
Thank you to Dave and Scott!! What I'm delaing with is mass production test for small memory cards in volume! The reason I choose Non-operating temperature cycling is so that I can deal with volume. I can throw in quite a few memory cards in chambe
Electronics Forum | Mon Nov 05 15:38:29 EST 2007 | ck_the_flip
As unlikely that this may be, if the RF circuit is sensitive enough, and the minor change in alloy is the only thing that changed, this MAY be the cause. The circuit was probably tuned to Sn63/Pb37. The reason I'm not surprised? I once had a custo
Electronics Forum | Sun Nov 04 11:53:19 EST 2007 | osomemac
I am looking for a mini acceleration switch for my application. It will be high volume, 1-5 million in quantity or better when in final production. It have to be really TINY and light weight. Packaging is not as critical since we do epoxy coated t
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