Electronics Forum | Wed Mar 24 16:54:38 EDT 2010 | stepheniii
J-STD-033B.1 Says "For cavity packages in which water may be entrpped, water clean processes after first reflow can be an additional source of moisture. This may present an additional risk, which should be evaluated." And it talks about derating if
Electronics Forum | Thu Mar 25 09:27:08 EDT 2010 | stepheniii
Thanks I guess I got used to google where the "and" is implied. I searched various combinations and all I could find were threads regarding the pcb's not the components. Does anyone bake their boards after wash before second reflow because of MSD c
Electronics Forum | Fri Mar 26 17:12:43 EDT 2010 | spitkis2
Krish, Looks like your peak temperature is around 230C and time above 183C is about 120-150 seconds. This is excessive for a leaded BGA. You should be aiming at 200 - 215C as the peak joint temperature with time above 183C of 60 -90 seconds. The p
Electronics Forum | Tue Mar 30 05:27:06 EDT 2010 | accuspares
Hi, Can you tell me at what point in the print cycle the error happens and if it consistently happens at the same point? The machine has two crash beams running down either side of the machine as a safety measure to ensure the table is down before
Electronics Forum | Fri Mar 26 21:48:56 EDT 2010 | dman97
Can someone explain to me what I'm supposed to do after I have done the vision offset calibration procedure? The manual tells me to put solder paste down on all 25 holes of the stencil. After this the board drops down and the machine scans each fidu
Electronics Forum | Fri Mar 26 23:07:07 EDT 2010 | dekhead
Just a guess: Are you printing your fiducials on the fiducial side of the board? Fidicial Side is for Vision Calibration, Bare Copper Side is for Offset Calibration (Step 5 of procedure says "copper side uppermost"). After printing 25 fiducials o
Electronics Forum | Wed Mar 31 10:55:42 EDT 2010 | fredc
I worked on a nozzle for one of these LEDs in the past. I seem to remember that there are raised surfaces outside the pick up area. Be sure your nozzle is not hitting them, if so you will lose vacuum. A rectangle shaped nozzle would maximize your abi
Electronics Forum | Sun Apr 11 01:32:35 EDT 2010 | ravikumarasahitec
Dear SMT stencil User, I am Ravikumar form Asahitec stencil pvt ltd chennai india. We basically manyfacturing of laser cut stencil (step up/down). and also we are trader of Lint free wiping rolls. The origin manufacturing company supplying all kind
Electronics Forum | Wed Mar 31 09:26:26 EDT 2010 | Bobpan
Hello, There should be a page in the manual that explains the proper way of manually teaching a program. It has been too long for me to recall the exact steps. Here is some stuff that should help you. Do a function 3 on a placement and this will show
Electronics Forum | Thu Apr 01 15:33:19 EDT 2010 | davef
"-How do these lint-free rags remove the flux that seeps under components = no matter its a no-clean material and we are removing for esthestics only." Don't think so ... Let's be clear. Low residue fluxes are benign only if: * Applied in amounts ac
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