Electronics Forum | Thu Jan 20 11:16:51 EST 2000 | Wolfgang Busko
Erico:I can�t even imagine what this line looks like and what it has to do with the soldering problems without having a look at it. Also the restriction to touchup only is somewhat irritating to me. The only thing that I can think of is that in your
Electronics Forum | Sat Jan 15 16:59:47 EST 2000 | Steve Thomas
Thanks, Mark. Actually we already have an established mark. We use 500ppm (99.95%) as our acceptable level. Problem is, someone (another manufacturer) told someone else (our pres.) that THEY build to 50ppm. Soooooo, someone else told my boss that
Electronics Forum | Fri Jan 14 16:58:20 EST 2000 | Dave F
Dave: You're probably correct about too much paste, given that your balling is congrigated near the center of the chips. Three things to consider: 1 Lower temperature profile @ front 3 zones 2 I've heard some stencil suppliers can plate addition
Electronics Forum | Fri Jan 14 17:24:08 EST 2000 | John Thorup
Yeah, it would be kind of expensive to replace all of your stencils but it's the only real answer. Be sure that all your new and replacement stencils have a home base or home plate shape for the passives. This reduces the paste volume near the cent
Electronics Forum | Thu Jan 13 13:16:40 EST 2000 | Dave F
Tony: You have choices: * Hi Temperature Tape: Go with Wolfgang ... too tough to control. * Selective Soldering Pallets: Some like 'em some don't. A lot of your success depends on the pallet fabricator. * Screenable Temporary Solder Mask: Wol
Electronics Forum | Tue Jan 11 05:46:09 EST 2000 | Wolfgang Busko
Hi Dave, that was kind of a more rhetorical question. Normally paste is used before shelflife expires and delivery time is short enough to get in no trouble. The normal situation is that you try to get your equipment running means constant use of pas
Electronics Forum | Tue Jan 11 07:46:23 EST 2000 | Dave F
Wolfgang: Boy it's tough to convey context in this medium, isn't it? Clipped from our paste storage work instruction, environmental effects on paste are: 1a Avoid excessive heat (over 80� F). It causes flux separation, reducing print quality. 1b
Electronics Forum | Fri Jan 07 01:05:40 EST 2000 | Dennis O'Donnell
I suggest you check out as many vendor at first as possible. Price varies greatly depending on your requirements. Once you find a company that has a price range that you are comfortable with, most can provide you with their formula so that you can
Electronics Forum | Wed Jan 05 16:46:44 EST 2000 | Dennis O'Donnell
Several methods work well. 1. (Low Volume Method) Using an Xacto blade, scrape off the solder mask holding the blade flush being careful not to use the pointed part of the blade. 2. (High Volume Method)Tape off the area that you don't want the mas
Electronics Forum | Wed Jan 05 11:01:37 EST 2000 | Ron Lahat
I have in design a 400mm x 400mm pcb 3.0 mm thick heavily populated with BGAs 50 mil pitch and want to run a double sided reflow process with overlapping BGAs (CS/PS) 1. can I avoid a selective jig for PS BGAs?(weight calculation ?) 2. Is it possibl
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