Electronics Forum: electronics (Page 6656 of 7890)

Rectangular uBGAs with 1 raised edge after reflow

Electronics Forum | Mon Aug 06 09:15:01 EDT 2001 | gdstanton

|120 |140 |160 |180 |180 |190 |260 | with a belt speed of about 28 IPM. The uBGAs are placed parallel to each other along the smallest side. The small edges closest to each other are raised slightly and form a "hill" when looking from the horizon o

Rectangular uBGAs with 1 raised edge after reflow

Electronics Forum | Tue Aug 07 08:20:47 EDT 2001 | CPI

Are there other components on the board? If so, how does solder quality look on them? Are they all reflowing? Are the sections of the uBGA�s sitting on a ground plane? Sounds like un-even heating. You should attach a couple thermal couples and see h

B.I.C. SMT Process Controls

Electronics Forum | Wed Aug 08 11:52:06 EDT 2001 | Michael Parker

Your reply with the reason for wanting the BIC data finally exposed the root cause of your problem. Good luck with trying to educate your suppliers. I have had copiuos amounts of experience with Asian cultures. First, you gotta know that they have a

Machine Monitors

Electronics Forum | Tue Aug 07 19:45:03 EDT 2001 | dougk

Here�s a nagging problem. We have several machines with old DOS-based interfaces (MPM printers, Electrovert ovens/waves, etc.). After some time, the monitors slowly fade-out due to over use (no screen blankers). We end-up ordering several new monitor

Mirror image BGA connectors

Electronics Forum | Thu Aug 09 12:36:26 EDT 2001 | Michael Parker

Adam- Mikie here. I too am placing 2 PBGA sockets on an assembly but they aren't mirror imaged. Thanks to the SMT Gods for that one. You say you added more paste to solve for open solder. Do you have x-ray? Were the alignments perfect? Also the part

Wave Soldering Ceramic PCB's - a result

Electronics Forum | Wed Aug 15 06:16:30 EDT 2001 | JohnW

Ok so an update on the ceramic board. I've had some success but did have to cheet a little. So Dave, on the fluxing, your right we're not getting it all the way up the barrel and in the end as a short term fix we're dipping the lead's in flux not th

Micro BGA baking

Electronics Forum | Fri Aug 10 15:46:07 EDT 2001 | davef

Probably, but the fabricator of these components can best respond to this question. The need to bake depends on the component design. J-STD-020 and J-STD-033 [as I recall] relate to moisture sensitive components and define 6 classes of moisture sen

Reflow Specs.

Electronics Forum | Thu Jun 13 11:24:25 EDT 2002 | davef

Sorry to hear about the Quality Department thing, but we all have our cross to bear, eh? Through an extended period, say 8 hours, understand change of critical controls in the following: * Conveyor speed. * Side to side temperature differences. * Ti

Design dilemma

Electronics Forum | Thu Aug 23 11:19:40 EDT 2001 | Hussman

Hi delnosa, Sorry about being 10 days late - don't get to the bottom of the page much. I'm working of layering flex circuits sandwiched between FR4 layers. The flex is primarily designed to take the place of interconnects like yours. I work in ap

Tear Down

Electronics Forum | Mon Aug 13 22:30:16 EDT 2001 | davef

When I was a kid, I used to go down to Mel's Gas Station on Dalton Avenue and get busted carborators and things like that from Mel. I'd take them home and take them apart. One time I was field stripping a carb, trying to remove a screw, but it was


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