Electronics Forum | Thu Dec 25 02:44:53 EST 2003 | Grant Petty
Hi, Thanks for the advice, and what models are you running. They have a few different models Horizon, etc, and I am trying to work out what would be best for us. I need accuracy, and reasonable speed, but also want to get the inspection options, as
Electronics Forum | Mon Feb 16 06:38:37 EST 2004 | Chris Lampron
Hi Carl, We have several Mirtec MV2BTLs. We had done an extensive evaluation on tabletop systems only, as we did not have the available real estate to add an inline. We are using the system to verify value (when visible) orientation, presence/absent
Electronics Forum | Sat Dec 13 18:08:23 EST 2003 | ex maintain leader
I am a SMT/PCBA process engineer with 10 years of > experience. I have been working abroad since I > graduated college in 1993. Recently I have > completed my MBA and want to relocate back home > to America. My problem is that I am having > trou
Electronics Forum | Mon Dec 22 18:10:09 EST 2003 | odody
Tony, Be very careful with used equipment dealers. Make suer they have a comprehensive remanufacturing plan for the equipment, that it is calibrated the same as it would be from the OEM, and that the staff that will install and maintain it are fami
Electronics Forum | Fri Dec 12 11:52:59 EST 2003 | Marc Simmel
I have encountered problems with a 90/10 tin-lead plated SMT component wicking all the solder paste off the pads on the substrate. Worst, the defect occurs randomly - adjacent leads may have 'good' joints, though heel fillets are poor. The solder pa
Electronics Forum | Fri Dec 12 17:19:08 EST 2003 | davef
Here's two angles to think about. Solder goes to the component and not both the board and the component because: * Component lead is much hotter than the the pad on the board. [This probably doesn't apply in your case, because it doesn't repeat fro
Electronics Forum | Mon Dec 22 19:43:43 EST 2003 | Dean
I have seen this affect on Immersion Tin and OSP. 70 to 90 % of the solder wicks to the lead and forms a "single" homogenous solder mass. This even though the pad was 100 % covered with paste... Evaluated different solder paste...did find variatio
Electronics Forum | Tue Dec 23 11:55:37 EST 2003 | Marc Simmel
Details, details: 1) The metal shell is part of the component body. The base metal is austenitic stainless steel (304) that has been plated with 90/10 tin-lead over nickel (semi-bright). 2) The entire part (leads and shell) is elevated by the mass o
Electronics Forum | Thu Dec 18 05:43:44 EST 2003 | ex maintain leader
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Electronics Forum | Wed Dec 17 09:53:26 EST 2003 | davef
IPC-2222 - Sectional Design Standard For Printed Board For Organic Printed Boards, Table 9-3 � Plated Through Hole Diameter To Lead Diameter Relationships will give you the standard information you require. If we can�t get proper hole fill after try
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