Electronics Forum | Thu Jul 28 09:47:06 EDT 2005 | fctassembly
Hello Carl, The main reason there is little information on lead free soldering to ENIG is because most of the lead free soldering to date has been Japanese consumer products. To keep costs down, the major surface coating used has been OSP copper. It
Electronics Forum | Mon Jul 04 22:09:08 EDT 2005 | grantp
Hi, I have one for sale, do you want it! MYDATA machines are perfect for low volume high mix production, and are fairly easy to operate. Don't get a TP model, as they cannot take the HYDRA head, and the MY series are much better. The good thing is
Electronics Forum | Tue Jul 05 11:00:37 EDT 2005 | patrickbruneel
Inds, This will happen with all lead-free alloys having a tin content above 70%. It takes about 30 sec. for a molten lead-free alloy to totally dissolve a copper pad. The higher the temperature the shorter the time and visa versa. The scary part of
Electronics Forum | Tue Jul 05 17:16:01 EDT 2005 | davef
We agree with Pat, but it's far from straight forward. [er maybe we should say we don't understand it.] We duplicated the results of a posting on the web. Flux, then dunk copper wire into tinning pots set at 250*C for measured periods of time. The
Electronics Forum | Wed Jul 06 13:06:22 EDT 2005 | patrickbruneel
Dave, Great to see you more involved in the lead-free. I assume the tests you have done were in lab environment, would it be possible to explain how you measured the area reduction (loss of weight or reduction of diameter/thickness) and how did you
Electronics Forum | Wed Jul 06 16:40:05 EDT 2005 | Inds
the problem with using SAC305 is we have a very small window within which the connnector has to be removed.. otherwise Cu will dissolute. Now this process window is something between 20sec to 30 sec..depending at what temperature you are reworking th
Electronics Forum | Thu Jul 07 04:34:19 EDT 2005 | Lloyd
This problem exists at a very low level but happens on all our discrete components, all our products and in two plants. Between the PCB land and the component termination there is a barrier of flux residue, this actually lifts the component slightly
Electronics Forum | Sat Jul 16 08:12:44 EDT 2005 | davef
skandaae: By "tilt" do you mean that one end of the 0603 has lifted from the board surface? If so, we call this "tombstone". In general, tombstoning is caused by an imbalance in temperature or forces on the component. * Convince yourself about the
Electronics Forum | Thu Jul 07 18:10:20 EDT 2005 | russ
You should use Xray to qualify your process. Frequency of Xray inspection after that will need to be determined by your process capability. If you use paste inspection process, once you verify that your profile and placement are good you in theory
Electronics Forum | Mon Jul 11 12:42:46 EDT 2005 | machine designer
I need a good digital photo or two of the turret of a Siplace (or equiv) style SMD pick and place head preferably laden with die or SMD parts to explain a bulk handling concept to some machine neophytes here. I could alternatively use an image of any
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