Electronics Forum | Wed May 12 11:02:00 EDT 2010 | eugene123
Hope every one are in good condition. I am Eugene, QA Engineer from Singapore, I been assigned to perform a electromigration test for the test coupon that consist 96 test point. Test condition: 85 deg C, 88% RH and 50V DC Measure Condition: 100V DC a
Electronics Forum | Mon May 17 13:34:22 EDT 2010 | davef
If it's not adhesive, try an ESD-type ionizer. The objective of an ionizer is to eliminate surface charge on insulators and on isolated/ungrounded conductors. Practically speaking, the action of an ionizer is to drive the voltage on the surface of a
Electronics Forum | Tue May 18 16:40:22 EDT 2010 | m79d
I am having some problems getting the IP1 to place a SSOP28 package,pitch 0.65mm lead width 0.3mm. I am selecting computer vision 012 (tried 011) and vision type 100. EL data was put in looking at the datasheet and also measuring the device. Have tri
Electronics Forum | Tue May 18 21:43:02 EDT 2010 | ashley
Hello mickd, 1) The EL data & Vision_type is NOT necessary when using MCS30 for IP1 machine. note : your input of the above might have cause confusion during VP, hence the OS error. 2) I would suggest the following... 2a) lower the Lead_check_are
Electronics Forum | Wed May 19 09:28:09 EDT 2010 | speedyuk
HI Im new to this but i thought i would have a go at fixing my xbox 360 be re balling it,ive managed to remove the gpu and take all the old solder balls of and cleaned it up,then ive put it in a re balling jig with the 360 stencil fluxed the gpu wi
Electronics Forum | Fri May 21 09:08:58 EDT 2010 | rway
We recently received in a reel of a QFP-64 TI processors. TI has such a great lead time right now, we were forced to find these parts where we could. Unfortunately you are forced to deal with less than reputable people. So these parts did not come
Electronics Forum | Wed May 19 16:02:32 EDT 2010 | remullis
I am currently experiencing major issues when printing fine pitch parts. Pad width is .008 Even starting with a new screen, fresh paste, etc. I see where the paste is not breaking away from the screen apts consistently and when inspecting the pads I
Electronics Forum | Wed May 19 17:43:25 EDT 2010 | pforister
Hello, I'm having problems with voiding on an assembly that has a GPS hybrid with balls much like a BGA. This is a RoHS assembly using no-clean solder (Kester EM907). The voids are at or above 25%. I use an 8 zone oven where I peak in zone 7 and
Electronics Forum | Fri Jun 04 01:13:31 EDT 2010 | boardhouse
Hi fotis, Big difference between Cem3 & FR4 is that FR4 the glass is woven and Cem3 is sheet glass non-woven. for Multi layer product, i would not consider Cem3 due to increase chance of de-lam due to lack of weave for strength. Cem1 and Cem3 are
Electronics Forum | Thu May 27 18:40:02 EDT 2010 | dcell_1t
Hi. I'm trying to develop a shape to place a QFN at a CP6, I'm using FujiFlexa. We have never had a shape for this particular component, we only draw as a rectangle and put a rectangle vision No (10 in this case) but we're scarifying accuracy. is th
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