Electronics Forum: electronics (Page 7246 of 7890)

Spray Fluxing

Electronics Forum | Thu Jan 18 04:30:52 EST 2001 | johnwatt

Ok so for me, spray fluxing is the way to go every time....for one you don't need to worry about colapsing your foam with pallet's that are hot or worrying about your pummace, your thinners, SG and so forth...man life in foam fluxer land was hard. N

Re: HTI Auto Print Screen Printers

Electronics Forum | Wed Jan 10 02:54:33 EST 2001 | george

Yo! first, lemme ask whether you refer the problem to HTI service engineers ? What was their reply? Can't they help you? Well when I was with a certain company in Singapore, we got an HTI Semi-Automatic Printer...it was bought at about 1994 and it wa

Re: ESD floor paint/coating

Electronics Forum | Sat Jan 06 10:12:51 EST 2001 | Dave F

Vinyl ESD floor tiles are probably the most expensive approach to "permanent" flooring, about $8 a square installed. VPI and 3M are reputable suppliers. Let me digress on ESD floor "waxes", the earlier poster�s comments are well taken, but the bigge

Re: Clean before conformal coating?

Electronics Forum | Thu Jan 04 20:16:02 EST 2001 | Mike Konrad

Hi Cory, As a manufacturer of aqueous cleaning systems, my advise is somewhat biased, however I believe it to be accurate. We have hundreds of customers who have implemented no-clean programs. The programs have been successful when measuring the r

Re: Clean before conformal coating?

Electronics Forum | Fri Jan 05 12:01:26 EST 2001 | Jim M

I've been involved with no-clean flux and conformal coat in the past.It has been my experience that the amount of no-clean flux used is proportionate to how well the conformal coat adheres to the boards.No clean paste did not affect adhesion. The co

Re: BGA coplanarity

Electronics Forum | Wed Jan 03 12:33:37 EST 2001 | Terry Burnette

John, There is one process issue that occurs with the larger BGA packages which have coplanarity near the high end of the .2mm spec.. The defect is commonly referred to as "ball in cup" and "head in pillow". It is an open solder connection whereby th

Re: Tombstoning 0402

Electronics Forum | Tue Dec 26 12:35:09 EST 2000 | Dave F

Your English is fine. Your assessment that corrosion on a portion of the metalization on the end of a component is causing the tombstoning is reasonable. We've seen that before. Corroded components received from a supplier is not acceptable as an

Re: Gold Finger Wear

Electronics Forum | Wed Dec 20 21:01:12 EST 2000 | Dave F

Talk about glam jobs � About once a month, we�d go over to the slaughter yard to get cows� teeth for Dr. Mueller. Then we�d fixture them on their side and run them in a machine that scrubbed them with a brush for weeks. The cool thing about cows te

Re: N2 vs. Air Reflow Soldering

Electronics Forum | Wed Dec 20 22:24:03 EST 2000 | Greenman

Dave: In terms of heat transfer, air is 78% nitrogen, and the remainder is mostly (20.9%) oxygen (roughly the same molecular weight as nitrogen), with a bit of argon (0.9%), CO2, hydrogen, monosodium glutamate etc. So you would expect virtually no d

Re: N2 vs. Air Reflow Soldering

Electronics Forum | Wed Dec 20 22:25:26 EST 2000 | Greenman

Dave: In terms of heat transfer, air is 78% nitrogen, and the remainder is mostly (20.9%) oxygen (roughly the same molecular weight as nitrogen), with a bit of argon (0.9%), CO2, hydrogen, monosodium glutamate etc. So you would expect virtually no d


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