Electronics Forum: electronics (Page 7251 of 7890)

Leadless(passives) solder joint criteria

Electronics Forum | Fri Sep 29 13:51:46 EDT 2000 | C. Ortner

We work in a "low" volume high reliability house building mixed tech double sided multi layer CCA's for long lived space applications. Our present problem is inspection questioning every dimple/anomaly on every leadless part(we put passives only thr

Re: the perfect SMT line configuration

Electronics Forum | Sun Oct 01 05:00:08 EDT 2000 | jarnopy

Okay, you have only few different product. Smallest package is 0402 and biggest is 144 pins ic. So, maybe you don't need get high-speed machine. You must place about 12000cmp/hour. You can buy quite cheap placement machine. I can't tell what is good

How to convince management on buying Equipment ? ---For Dave F, Wolfgang, Moonman and the rests!!!

Electronics Forum | Wed Sep 27 08:50:51 EDT 2000 | Dreamsniper

Hi Guys, I've compared stencil printing adhesive versus acquiring a dispensing equipment. Had breakdown all the costs against each other. It end up that Stencil Printing Adhesive is more costly than equipment dispensing machine in the long term (5 y

Re: How to convince management on buying Equipment ? ---For Dave F, Wolfgang, Moonman and the rests!!!

Electronics Forum | Tue Oct 03 11:07:00 EDT 2000 | C.K.

"In Reality there's no additional cost or extra cost for the cleaning time since there is no increase on operator's wage in doing the cleaning but instead just an additional load or job for the operators at the same wage cost." I'd have to agree...

Re: How to convince management on buying Equipment ? ---For Dave F, Wolfgang, Moonman and the rests!!!

Electronics Forum | Wed Oct 04 14:54:46 EDT 2000 | Sean

I feel Woldgang poses an interesting question. It seems you have already decided that dispensing is the path you wish to take. Yet can you tell us why? Is there a flexibility vs. throughput arguement here? Justification of dispense via the cleani

Re: Coplanarity on fine pitch QFP

Electronics Forum | Tue Sep 26 09:27:10 EDT 2000 | Chris May

LarryK, It all depends upon your volume / problem. As Jax says, if this is a repeating problemo, get QA & Purchasing involved. Is it your stores ? Do they receive 100 off and "decant" 20 into a tube (manual handling error, training etc;). From your

Re: Capability Study for Solder Printing Process

Electronics Forum | Wed Sep 20 19:34:13 EDT 2000 | Dave F

Congrats. You now control the source of almost 70% of the defects of your SMT operation. There is a neat series of presentations on printing, each year at SMI. One of the best of the SMI series was in 1997, because presenters used a common board

Re: Capability Study for Solder Printing Process

Electronics Forum | Sat Sep 23 15:13:40 EDT 2000 | Francois Racine

Hi Sophia, I`m responsible of SMT line and we solved this problem with a complete automatic solder paste printer machine. In the past we had problem with off alignment and solder height too.... at that time we used a semi-auto printer machine and w

Re: Capability Study for Solder Printing Process

Electronics Forum | Tue Jan 23 22:38:43 EST 2001 | rpereira

I have recently completed a HUGE screen-printing DOE. I used Taguchi methodology and man I got good results! Here is what I learned for what it's worth: (p.s. to the MPM apps guy I sent a copy to Tim Gillis, Lou Fuda, etc...) EFab vs. Laser: EFab

Re: CTE mismatch

Electronics Forum | Fri Sep 15 16:37:49 EDT 2000 | Dave F

Sounds like someone aimin� fo tha big hurt, if ya axes me. Two spots to place your lawn darts are: 1 J Hwang in "Modern Solder Technology � " states (p.354) that " � extreme CTE mismatch between silicon IC (~2) and the PCB (~16), solder connections


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Nordson Electronics Solutions
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