Electronics Forum | Tue Jan 11 19:47:58 EST 2011 | sai
Use the Kester solder paste EM828 SAC305. Guarantee good reflow. Peak@250 Reflow@80s Soak@75s.
Electronics Forum | Tue Feb 01 10:11:36 EST 2011 | clampron
good Morning, it looks from the peak temperature that this is a RoHS application? If so, is the BGA that you are having issues with leaded? If so, you might be experiencing "ball drop" where the ball becomes disconnected from the component substrate
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