Electronics Forum: embrittlement (Page 1 of 11)

Gold embrittlement

Electronics Forum | Thu Nov 11 17:49:54 EST 1999 | Jeff_Tamagi

Do I have to tin gold lead devices? Can I use indium? Can I use lead-free Can I use tin-free

Re: Gold embrittlement

Electronics Forum | Fri Nov 12 16:59:58 EST 1999 | John Thorup

Hi Michael While driving home last night I realized the omission in my response. I thought someone would call me on it. I should have clarified that the dissolution of the gold into the joint would be affected by the thickness of the gold plating,

Re: Gold embrittlement

Electronics Forum | Thu Nov 11 18:39:06 EST 1999 | John Thorup

Assuming that you are going to solder them into a board rather than socket them, yes. The thickness of the gold plating in this application will usually make up a large enough percentage of the total joint to threaten enbrittlement. Use a small sol

Re: Gold embrittlement

Electronics Forum | Fri Nov 12 16:27:43 EST 1999 | Michael Allen

The papers I've read suggest that we need to be concerned if the weight percent of gold in the finished joint exceeds 3%. You might want to do the calculations to see where you stand, before you set up a process to "tin" the leads. If you find that

gold embrittlement on paste in hole 30 micro in. gold plated lead

Electronics Forum | Fri May 28 17:30:35 EDT 1999 | Dave Clements

I discovered that we have some gold plated (30 mico in.) through hole connectors which were Paste In Hole soldered (60 sec at reflow) on a HASL PCB. Do we have an embrittlement reliability issue? The calculated volume % of gold in the joints is about

Re: gold embrittlement on paste in hole 30 micro in. gold plated lead

Electronics Forum | Fri May 28 17:44:51 EDT 1999 | Glenn Robertson

I discovered that we have some gold plated (30 mico in.) through hole connectors which were Paste In Hole soldered (60 sec at reflow) on a HASL PCB. Do we have an embrittlement reliability issue? The calculated volume % of gold in the joints is abo

Gold Embrittlement

Electronics Forum | Tue Jun 01 19:35:39 EDT 2004 | Ken

There are studies out there that looked at gold embrittlement. The overall consensus is to not exceed 5% by weight. As far as the conductivity question, as themo/mechanical creep fatigue sets in, your conductivity will be affected as the joint is s

Embrittlement Sucks.....

Electronics Forum | Fri Aug 21 13:46:50 EDT 1998 | Ben Salisbury

It's been one hell of a week.... From personal experience, what are the most common causes for embrittlement of the solder joint? I just need to make sure I've got all my bases covered. thanks -Ben

ENIG vs Flash Gold

Electronics Forum | Thu Apr 20 13:42:23 EDT 2006 | fredericksr

I've seen embrittlement %s down to 3%, but a standard 5 mil solder pad would require well over 100uIn of plated gold to cause embrittlement. -Other Russ

Au Thickness in ENIG PCB

Electronics Forum | Wed May 05 15:31:14 EDT 2021 | edhare

0.5 to 1 micron is typically too thick and can result in gold embrittlement of the solder joint. Typical IG thickness is 0.18 microns. see https://www.semlab.com/papers/gold-embrittlement-of-solder-joints/ Ed Hare

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