Electronics Forum | Tue Mar 18 11:52:38 EDT 2008 | rrpowers
A couple years back we were looking at going to an enclosed solder paste printing process, similar to the ProFlow, Crossflow, or Rheometric Pump. We have older MPM AP25's with a custom transport. Speedline told us that in order to add the RheoPump,
Electronics Forum | Wed Sep 14 04:09:21 EDT 2016 | jimmyh
We are enclosing our SMT room and will control the Humidity and Temperature of the room. Is there a standard for humidity and temperature for a SMT room and if so what is it. What is protocol if it goes out of tolerance? Do we stop production? Is
Electronics Forum | Fri Aug 23 12:35:09 EDT 2002 | msjohnston
Has anyone done a study or know of one that addresses the flow / no-flow underfill differences for CSP devices. My main interest is in the reliability of the CSP and underfill. Any help would be great. Thanks, Mike
Electronics Forum | Fri Aug 23 18:51:00 EDT 2002 | edahi
weve done a few evaluations for the no-flow underfill and for the reliability I think it has already passed MRT L3 @ 220C reflow. What is it specifically you're interested about the flow u/fill??
Electronics Forum | Fri Apr 10 20:04:00 EDT 2020 | jlawson
> Fabrication Format. With good tools Like Valor MSS PP you can handle the old (legacy flows) and of course better more modern flows all from one learning library solution = more effective first time right outputs
Electronics Forum | Tue Sep 29 11:49:02 EDT 2015 | spoiltforchoice
Typically - hand soldering as you are currently doing. Should your volume justify it you can invest in a selective soldering solution, these might take the form of a robotic arm that essentially replicates manual soldering or a solder jet similar to
Electronics Forum | Wed Oct 11 09:32:26 EDT 2006 | Rob
Correct. Remember, you need the charge to flow to earth from yourself, the heel strap/conductive shoes etc. facilitate this, otherwise you would stay charged no matter how good the floor was.
Electronics Forum | Mon Apr 08 20:43:58 EDT 2002 | davef
Regardless of the design technology of the board, we use shop floor management software that: * Calculates the period that it takes to assemble a job. Obviously, we enter product-manufacturing information [ie, BOM, material receipt dates, process fl
Electronics Forum | Sat Oct 06 05:33:47 EDT 2001 | spchua
I had recently encounter the "black and grey" pads problems for the BGA pad after the convection re-flow. The pads shows in in "black and grey" color and a litter solder in it, and it happen in ramdom, when applied heat and solder on the "black and g
Electronics Forum | Fri Mar 03 14:40:22 EST 2006 | amol_kane
i think a more important issue here would be the reduction ratio. as LF solders have a higher surface tension, they do not flow as well as their leaded counterparts. therefore the stencil design may have to be changed (hence a new stencil) if the red
