Electronics Forum | Mon Apr 13 23:02:52 EDT 2009 | davef
Use IPC-4552 for your ENIG thickness. Typically, ENIG has nickel deposit with medium [7-9 percent by weight] phosphorus content. That's what fabs do on rigid boards. On a flex with medium-P and IPC-4552 specified ENIG, you could see brittleness and
Electronics Forum | Wed Apr 15 13:07:12 EDT 2009 | RHK
Thank you! I am looking into this, but main idea is to use rigid board in place of flex.
Electronics Forum | Thu Jun 04 01:48:34 EDT 2009 | nibirta
yes, i know this part, and you are right. Tk you once again, Nico
Electronics Forum | Wed Nov 04 09:16:45 EST 2009 | gregoryyork
what level did you have
Electronics Forum | Wed Nov 04 09:47:25 EST 2009 | tstrat
It was 7 wt% according to the EDS spectrum at the EN layer near the ball-pad interface.
Electronics Forum | Mon Sep 09 21:54:01 EDT 2013 | mandysmile
Hi, rod, The exposed copper area you could do with ENIG. It is with good solderability.
Electronics Forum | Wed Jan 07 17:39:26 EST 2015 | duchoang
Additional info: I use SAC305 solder paste on Enig PCB.
Electronics Forum | Wed Jan 13 15:47:57 EST 2016 | dyoungquist
What surface finish are you using on the bare PCBs? ENIG, Silver, OSP, Leadfree HASL, etc.?
Electronics Forum | Fri Mar 04 08:29:53 EST 2016 | esoderberg
Anyone using Entek OM final finish to replace HASL & ENIG?
Electronics Forum | Fri Nov 25 20:57:30 EST 2016 | sarason
You guessed right. Not hot enough to get good reflow. regards sarason